TDA7294V Integrated Circuits Linear Amplifiers Audio TDA7294 Multiwatt-15 IC chip TDA 7294 Electronic components TDA7294V

Technical specifications

Customization guide

Adjustable parameters include heat sink size and PCB layout to meet specific power requirements or thermal constraints. For instance, increasing the heat sink surface area can boost cooling efficiency by 20%, ideal for high-temperature environments.

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With the TDA7294V’s robust design and thermal management, engineers can build reliable audio systems, power amplifiers, or industrial electronics that maintain peak performance even under heavy load.

Choose your model

Supplier's note

1. Breakthrough Features:

   • The aluminum heat sink achieves 20% faster heat dissipation than traditional designs, enabling continuous operation in high-power scenarios.
   • FR-4 PCB material ensures 30% better thermal stability compared to standard materials, reducing component degradation.
   • Modular design allows 50% faster integration into custom systems versus non-modular alternatives.

2. Version Selection Guidance:

   • Base Model: Ideal for standard audio amplifiers (e.g., home theaters) where cost-efficiency is prioritized.
   • Advanced Model: Suitable for professional audio systems requiring enhanced protection and efficiency (e.g., live sound equipment).
   • Pro Model: Best for industrial applications (e.g., power supplies, industrial audio) needing extreme durability and high output.

   Example: The Pro Model’s 90% efficiency rating reduces energy waste by 15% compared to industry benchmarks, while its EMI shielding ensures seamless operation in electrically noisy environments.