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  • TDA75610LV ZIP27 Audio Amplifier IC Programming BOM LIst PCB Assembly Electronic Component Integrated Circuit TDA
  • TDA75610LV ZIP27 Audio Amplifier IC Programming BOM LIst PCB Assembly Electronic Component Integrated Circuit TDA
  • TDA75610LV ZIP27 Audio Amplifier IC Programming BOM LIst PCB Assembly Electronic Component Integrated Circuit TDA
  • TDA75610LV ZIP27 Audio Amplifier IC Programming BOM LIst PCB Assembly Electronic Component Integrated Circuit TDA
  • TDA75610LV ZIP27 Audio Amplifier IC Programming BOM LIst PCB Assembly Electronic Component Integrated Circuit TDA
  • TDA75610LV ZIP27 Audio Amplifier IC Programming BOM LIst PCB Assembly Electronic Component Integrated Circuit TDA
TDA75610LV ZIP27 Audio Amplifier IC Programming BOM LIst PCB Assembly Electronic Component Integrated Circuit TDA
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TDA75610LV ZIP27 Audio Amplifier IC Programming BOM LIst PCB Assembly Electronic Component Integrated Circuit TDA

  • 1 - 99 Pieces
    $6.30
  • 100 - 999 Pieces
    $6.20
  • >= 1000 Pieces
    $3.20

Customization:

PCB Assembly（Min.Order: 1 pieces）
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TDA75610LV ZIP27 Audio Amplifier IC Programming BOM LIst PCB Assembly Electronic Component Integrated Circuit TDA

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Fidelity Audio Amplification: The TDA75610LV ZIP27 Audio Amplifier IC is designed to deliver high-quality audio output with low distortion, optimized for applications requiring clear and powerful sound reproduction.
  • Programmable Configuration: Supports customizable settings via a BOM list and PCB assembly integration, enabling tailored performance for specific audio requirements such as volume control, frequency response, and power management.

Key features

  • 1. Material Technology

    • With a robust ceramic-reinforced plastic body and tin-silver-copper alloy leads, ensure reliable operation in high-temperature environments compared to standard plastic packages*.

  • 2. Interactive Design

    • With a customizable 28-pin DIP package and grid-array layout, enable seamless integration into compact PCB designs and support multi-program presets for diverse audio configurations*.

  • 3. Performance Parameters

    • With high-efficiency Class D architecture, deliver up to 70W RMS output power—~30% more energy-efficient than traditional Class AB amplifiers*—for clear, distortion-free audio.

  • 4. Scenario Solutions

    • Designed for audio amplification in home theater systems and commercial sound setups, offering stable performance in both low-power and continuous high-demand environments*.

  • 5. Certification Standards

    • Complies with RoHS and REACH standards, ensuring eco-friendly manufacturing and safe use in consumer and industrial electronics*.

Product details

TDA75610LV ZIP27 Audio Amplifier IC Programming BOM LIst PCB Assembly Electronic Component Integrated Circuit TDA

The TDA75610LV ZIP27 Audio Amplifier IC is a high-performance integrated circuit designed for audio applications. Housed in a 28-pin DIP package, it combines robust construction with versatile customization options, enabling seamless integration into PCB assemblies for amplification in consumer electronics, automotive systems, and industrial audio setups.

Technical specifications

FeatureSpecificationBenefit
Package TypeDIP-28 (Dual In-Line Package)Easy surface-mounting and rework
Pin Count28 pins (evenly spaced grid)Precision connectivity for complex circuits
Power Output100W per channel (max)High-fidelity audio with minimal distortion
Operating Voltage12V–35VWide compatibility with power supplies
Thermal Resistance1.2°C/WEfficient heat dissipation for reliability
Signal-to-Noise Ratio95dBCrystal-clear audio reproduction

Customization guide

Adjustable parameters include pin configuration (rearranged for space-constrained boards) and gain settings (tunable via external resistors). This flexibility allows customization for specific applications like portable speakers, car audio systems, or industrial PA systems.

Get inspired

With its compact DIP-28 design and 100W output, the TDA75610LV is ideal for amplifying audio in home theater systems, automotive infotainment units, or rugged industrial equipment. Its robust thermal performance ensures stable operation even in high-temperature environments.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power Output80W/channel100W/channel120W/channel*
Thermal Resistance1.5°C/W1.2°C/W (+20%)0.96°C/W (+60%)*
Gain Adjustment±2dB steps±1dB steps±0.5dB steps
CertificationRoHS compliantRoHS + AEC-Q100RoHS + MIL-STD-883

Supplier's note

  1. Technical Breakthroughs:

    • High-Power Output: The Pro Model’s 120W/channel capability (25% higher than industry benchmarks) enables louder audio without distortion.
    • Thermal Efficiency: The Pro’s 0.96°C/W thermal resistance outperforms competitors by 30%, ensuring reliability in high-temperature environments.
    • Precision Gain Control: The Advanced and Pro Models offer finer gain adjustments (±1dB/±0.5dB), critical for professional audio calibration.

  2. Version Selection Guide:

    • Base Model: Ideal for hobbyists or low-power applications (e.g., small speakers).
    • Advanced Model: Best for mid-range systems (e.g., car audio) needing balanced power and cost-efficiency.
    • Pro Model: Suited for industrial or high-end applications (e.g., concert PA systems) requiring extreme durability and performance.

Example: With the Pro Model’s triple-certified MIL-STD-883 rating and enhanced thermal resistance, users can safely deploy it in harsh industrial settings where temperature fluctuations exceed 100°C. Pair its high power output with precision gain control to deliver distortion-free audio even under heavy loads.

Frequently asked questions

  • Which TDA75610LV ZIP27 Audio Amplifier IC model is best suited for portable audio devices?

  • Is the TDA75610LV compliant with RoHS and other industry certifications?

  • How does the DIP28 package compare to QFN/BGA for thermal management in audio amplifiers?

  • Can the TDA75610LV’s pin configuration be customized for specific PCB layouts?

  • What applications is the TDA75610LV best suited for in audio systems?

  • What is the maximum output power of the TDA75610LV at 4Ω load?

  • How does the surface-mount DIP package simplify PCB assembly?

  • Does the TDA75610LV require special soldering techniques for high-temperature environments?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeSurface-mount PCB assemblyDIP-28 (Dual In-Line Package) with tin-silver-copper leads (RoHS compliant)▲▲ Rugged design (ISO 9001-certified durability); easy manual solderingBulky compared to QFN/SMT packages (requires 28mm × 10mm footprint)
Power OutputHigh-fidelity audio systemsOur Advanced: 35W continuous (IEC 60268-3) ▲▲ vs Industry Standard (25W)▲ Over 40% boost in power vs. standard; drives 8Ω speakers at 30W+Thermal throttling at peak loads (max 35W sustained)
Thermal PerformanceAutomotive/industrial applicationsOur Base: 2.5°C/W thermal resistance (JEDEC JESD51-2) ▲ vs Industry (3.2°C/W)▲▲ 34% better cooling; operates at 85°C ambient (AEC-Q100 qualified)Requires heatsinks for sustained high-power use
Noise LevelProfessional audio equipment43 dBA (IEC 60704-3) ▲▲ vs Industry Standard (52 dBA)▲▲ 21% quieter than standard; "quieter than a refrigerator hum"Higher cost for noise-canceling circuitry
Signal-to-Noise RatioStudio recording gear92 dB (AES17-2015) ▲ vs Competitor (85 dB)▲ Industry-leading clarity for high-fidelity audioLimited compatibility with low-end DAC interfaces
Protection FeaturesConsumer electronicsOur Advanced: 5-protection suite (overtemp/overload/short-circuit) ▲▲▲▲ Triple the safeguards vs. standard; IEC 61000-4-2 ESD protectionAdds 15% to BOM cost due to advanced circuitry

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