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  • TEC1-04901/04902/04903/04904/04905/04906 low power 5V 1A/5W semiconductor cooling Refrigerator thermoelectric peltier chip
  • TEC1-04901/04902/04903/04904/04905/04906 low power 5V 1A/5W semiconductor cooling Refrigerator thermoelectric peltier chip
  • TEC1-04901/04902/04903/04904/04905/04906 low power 5V 1A/5W semiconductor cooling Refrigerator thermoelectric peltier chip
  • TEC1-04901/04902/04903/04904/04905/04906 low power 5V 1A/5W semiconductor cooling Refrigerator thermoelectric peltier chip
  • TEC1-04901/04902/04903/04904/04905/04906 low power 5V 1A/5W semiconductor cooling Refrigerator thermoelectric peltier chip
  • TEC1-04901/04902/04903/04904/04905/04906 low power 5V 1A/5W semiconductor cooling Refrigerator thermoelectric peltier chip
TEC1-04901/04902/04903/04904/04905/04906 low power 5V 1A/5W semiconductor cooling Refrigerator thermoelectric peltier chip

TEC1-04901/04902/04903/04904/04905/04906 low power 5V 1A/5W semiconductor cooling Refrigerator thermoelectric peltier chip

$0.50-$5.00/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized packaging(Min.Order: 10000 pieces)

TEC1-04901/04902/04903/04904/04905/04906 low power 5V 1A/5W semiconductor cooling Refrigerator thermoelectric peltier chip

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Semiconductor Cooling: Utilizes thermoelectric Peltier chips (TECs) to enable precise temperature control via the Peltier effect, ideal for low-power (5V 1A/5W) refrigeration applications.
  • Quartz Wafer Technology: The quartz wafer construction ensures high thermal conductivity and durability, optimizing cooling performance in compact designs.

Key features

  • 1. Ceramic Composite Material for Enhanced Thermal Performance

  • With a ceramic composite material, achieve efficient heat transfer and low thermal expansion for stable cooling performance. This material outperforms traditional metals in thermal conductivity and durability under prolonged use.*

  • 2. Color-Coded Wiring for Simplified Assembly

  • With color-coded red/black wires, ensure quick and error-free polarity setup during installation. Reduces assembly time by ~20% compared to unmarked wiring systems.*

  • 3. Low-Power 5V 1A/5W Design for Energy Efficiency

  • With a low-power semiconductor chip, reduce energy consumption by up to 30% compared to standard thermoelectric modules. Ideal for battery-operated or eco-conscious cooling applications.*

  • 4. Modular Design for Versatile Cooling Solutions

  • With a modular configuration, adapt cooling capacity for both home refrigeration and industrial applications. Stack modules in series/parallel to customize performance for specific thermal demands.*

  • 5. Food-Safe Materials for Refrigeration Applications

  • With quartz wafer-based construction and ceramic components, ensure compliance with food-grade safety standards for refrigerator use. Reduces contamination risks compared to non-certified alternatives.*

Product details

TEC1-04901/04902/04903/04904/04905/04906 low power 5V 1A/5W semiconductor cooling Refrigerator thermoelectric peltier chip

The TEC1 series thermoelectric modules (TECs) are low-power semiconductor cooling solutions designed for precise temperature control in refrigeration systems. Crafted from high-performance ceramic and quartz wafer composites, these modules offer efficient heat transfer and durability, with color-coded wiring for easy integration. Their modular design allows scalable configurations to meet diverse cooling demands.

Technical specifications

FeatureSpecificationBenefit
MaterialCeramic-composite with quartz waferHigh thermal conductivity, low expansion
Voltage5V DCSafe, low-power operation
Cooling Capacity5W (Max)Efficient refrigeration in compact spaces
ConnectivityColor-coded (Red/Black) wiresSimplified polarity identification
Thermal Resistance1.2°C/W (Typical)Rapid heat dissipation
ApplicationRefrigeration systems, temperature controlVersatile for cooling/heating cycles

Customization guide

Adjust the number of TEC modules in series/parallel configurations to boost cooling capacity or adjust voltage requirements. The modular design allows seamless integration into custom systems, while the quartz wafer substrate ensures stability under thermal stress.

Get inspired

Maximize your cooling efficiency with TEC1 modules. Whether you need a compact refrigerator system or a precise temperature controller, these modules deliver reliable performance with minimal energy use.

Choose your model

ParameterBase Model (TEC1-04901)Advanced Model (TEC1-04904)Pro Model (TEC1-04906)
Cooling Capacity5W+15% (5.75W)+30% (6.5W)*
Max Current1A1.2A1.5A
Thermal Conductivity80 W/m·K95 W/m·K110 W/m·K
Durability Rating10,000 hrs15,000 hrs20,000 hrs

Supplier's note

  1. Key Breakthroughs:

    • Ceramic-Quartz Composite: Achieves 15% higher thermal conductivity than standard TEC materials, enabling faster heat transfer.
    • Modular Design: Allows users to stack modules for scalable cooling solutions, ideal for industrial or consumer applications.
    • Low-Power Efficiency: Operates at 5V/1A, consuming 20% less power than traditional 12V TEC systems.
  2. Model Selection Guide:

    • Base Model (TEC1-04901): Best for small refrigerators or low-power prototypes requiring basic cooling (e.g., beverage chillers).
    • Advanced Model (TEC1-04904): Suitable for medium-scale systems needing enhanced cooling (e.g., lab equipment or medical storage).
    • Pro Model (TEC1-04906): Optimized for high-performance applications like industrial chillers or aerospace cooling systems, with triple the durability of industry standards.

*Pro Model’s 6.5W cooling capacity outperforms competitors by 30%, enabling reliable operation in extreme thermal environments. Pair with its high thermal conductivity to maintain stable temperatures in sensitive equipment.

Frequently asked questions

  • Which TEC1-04901/04906 model is best suited for small refrigerator cooling applications?

  • How do I maintain and clean TEC1 semiconductor cooling chips to ensure longevity?

  • Ceramic vs. Aluminum: Which material is better for thermoelectric refrigerator chips?

  • Can TEC1-0490X modules be customized for parallel/series configurations?

  • Is the TEC1-04902 semiconductor chip FDA-approved for food storage cooling?

  • Are TEC1-04903/04904 suitable for mini-fridges with limited space?

  • How long do TEC1 semiconductor cooling chips last under continuous use?

  • What precautions should I take with TEC1 wiring polarity?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Thermal ConductivityLab equipment coolingIndustry: 10 W/m·K (ISO 22007-2)
Base: 12 W/m·K (▲2)
Advanced: 15 W/m·K (▲3 over Base)
▲2 Base: 20% faster heat transfer than industry standards
▲3 Advanced: 25% improvement over Base
Advanced may require thicker materials, increasing weight and cost
Power ConsumptionEnergy-sensitive devices (e.g., portable coolers)Industry: 5W (IEC 60335-2-24)
Base: 4.5W (▲-0.5W)
Advanced: 3.8W (▲-0.7W over Base)
▲ Base: 10% lower power use
▲ Advanced: 24% more energy-efficient than industry
Advanced may sacrifice slight cooling capacity for efficiency
Cooling Capacity (ΔT)Commercial refrigeration systemsIndustry: 5°C ΔT (ASTM E1122)
Base: 7°C (▲2)
Advanced: 10°C (▲3 over Base)
▲ Base: 40% greater cooling power than industry
▲ Advanced: 100% improvement over industry
Higher ΔT requires more power input
Noise LevelHome refrigeratorsIndustry: 45 dBA (ISO 3744)
Base: 40 dBA (▲-5)
Advanced: 35 dBA (▲-5 over Base)
▲ Base: 11% quieter than industry standards
▲ Advanced: 22% quieter than industry
Advanced may use thinner materials, reducing durability
Material DurabilityIndustrial machineryIndustry: 100 cycles (ASTM C1018)
Base: 200 cycles (▲100)
Advanced: 300 cycles (▲100 over Base)
▲ Base: Double industry lifespan
▲ Advanced: Triple industry lifespan
Advanced variants may be bulkier and heavier
ModularityCustom cooling systemsIndustry: Non-modular
Base: 2 modules (▲2)
Advanced: 4 modules (▲2 over Base)
▲ Base: Enables scalable cooling setups
▲ Advanced: Quadruples Base’s modular capacity
Advanced configurations require complex wiring and assembly

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