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  • TRF4260QPHNRQ1 Electronic Components Integrated Circuits Ic Chips SOP TRF4260
  • TRF4260QPHNRQ1 Electronic Components Integrated Circuits Ic Chips SOP TRF4260
  • TRF4260QPHNRQ1 Electronic Components Integrated Circuits Ic Chips SOP TRF4260
  • TRF4260QPHNRQ1 Electronic Components Integrated Circuits Ic Chips SOP TRF4260
  • TRF4260QPHNRQ1 Electronic Components Integrated Circuits Ic Chips SOP TRF4260
  • TRF4260QPHNRQ1 Electronic Components Integrated Circuits Ic Chips SOP TRF4260
TRF4260QPHNRQ1 Electronic Components Integrated Circuits Ic Chips SOP TRF4260

TRF4260QPHNRQ1 Electronic Components Integrated Circuits Ic Chips SOP TRF4260

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TRF4260QPHNRQ1 Electronic Components Integrated Circuits Ic Chips SOP TRF4260

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Signal Processing: The TRF4260QPHNRQ1 is an integrated circuit (IC) designed for high-speed digital and analog signal processing, enabling efficient data transmission and control in electronic systems.
  • Compact SMD Design: Its surface-mount device (SMD) package allows seamless integration into high-density PCB layouts, optimizing space and enhancing reliability in modern electronics.

Key features

  • 1. Advanced Silicon-Based Construction

    • With a silicon-based construction, ensure reliable performance in high-density applications. ~20% smaller footprint than traditional through-hole ICs*.

  • 2. Compact SOP Package Design

    • With a compact SOP package design, easily integrate into space-constrained devices, reducing assembly complexity*.

  • 3. High-Speed Signal Processing

    • With high-speed signal processing capabilities, achieve faster data transmission rates compared to standard ICs*.

  • 4. Optimized for High-Density PCB Layouts

    • With optimized compatibility for high-density PCB layouts, deploy in compact electronics like smartphones or IoT devices for enhanced functionality*.

  • 5. RoHS Compliance Certification

    • With certification to RoHS environmental standards, ensure compliance with global regulatory requirements for eco-friendly manufacturing*.

Product details

TRF4260QPHNRQ1 Electronic Components Integrated Circuits Ic Chips SOP TRF4260

The TRF4260QPHNRQ1 is a high-performance integrated circuit (IC) designed for RF and IF signal amplification. Built with advanced semiconductor materials, it offers compact dimensions (SOP-8 package) and robust performance for applications requiring precise gain control and low power consumption.

Technical specifications

FeatureSpecificationBenefit
Package TypeSOP-8 (Small Outline Package)Compact design for high-density PCB layouts
Frequency RangeDC to 650 MHzSupports high-speed RF/IF signal processing
Supply Voltage2.7V to 5.5VWide compatibility with power sources
Gain ControlAdjustable up to 65 dBDynamic signal amplification for diverse use
Power ConsumptionUltra-low (typical 12 mW at 3V)Extended battery life in portable devices

Customization guide

Adjustable gain settings and supply voltage ranges allow customization to meet specific signal amplification needs. Thermal management options are available for high-power applications.

Get inspired

Ideal for wireless communication systems, consumer electronics, and industrial IoT devices, the TRF4260QPHNRQ1 delivers reliable performance in compact form factors.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Frequency Range650 MHz+15% (747.5 MHz)+30% (845 MHz)*
Max Gain65 dB+10% (71.5 dB)+20% (78 dB)
Power Consumption12 mW (3V)10 mW (3V)8 mW (3V)

Supplier's note

  1. Technical Breakthroughs:

    • High-Frequency Capability: The TRF4260’s 650 MHz range enables seamless integration into 5G and IoT systems.
    • Low Power Consumption: 20% lower power use than traditional RF amplifiers, ideal for battery-operated devices.
    • Variable Gain Control: Adjustable gain (up to 65 dB) ensures optimal signal quality in noisy environments.

  2. Optimal Version Selection:

    • Base Model: Suitable for standard RF applications (e.g., Bluetooth, Wi-Fi modules) where cost efficiency is prioritized.
    • Advanced Model: Recommended for industrial IoT or automotive systems requiring 15% higher frequency handling.
    • Pro Model: Best for 5G infrastructure or radar systems needing triple the industry-standard thermal stability and double the gain of legacy designs.

With its ultra-low power consumption, you can extend battery life in wearable devices. The Pro version’s 845 MHz capability ensures compatibility with next-gen wireless standards.

Frequently asked questions

  • Which TRF4260QPHNRQ1 model is best suited for high-frequency RF applications?

  • Is the TRF4260QPHNRQ1 IC RoHS-compliant and FDA-approved for medical devices?

  • How does the silicon material in TRF4260QPHNRQ1 ICs compare to ceramic substrates for thermal performance?

  • What applications are the TRF4260QPHNRQ1 ICs designed for in electronic systems?

  • Can the TRF4260QPHNRQ1 SMD IC be used in high-density PCB layouts?

  • What performance features make the TRF4260QPHNRQ1 IC suitable for high-speed applications?

  • What are the best practices for installing TRF4260QPHNRQ1 SMD components on a PCB?

  • How does the TRF4260QPHNRQ1 IC’s design ensure long-term reliability in electronic devices?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
SMD ICsHigh-density PCBs in smartphones, serversPackage Size: 5x5mm (Industry Standard) ▲ 4x4mm (Our Base) ▲▲ 3x3mm (Our Advanced)
Power Consumption: 1W (Industry) ▲ 0.8W (Base) ▲▲ 0.5W (Advanced, eco-friendly)		Compact, high integration, easy assemblyRequires specialized repair tools
TransistorsSignal amplification, switching circuitsCurrent Handling: 1A (Industry) ▲ 2A (Base) ▲▲ 3A (Advanced)
Switching Speed: 1GHz (Industry) ▲ 2GHz (Base) ▲▲ 3GHz (Advanced)		Versatile, cost-effectiveLimited power handling in some types
Bipolar Junction Transistors (BJTs)Amplifiers, oscillatorsGain: 50 (Industry) ▲ 70 (Base) ▲▲ 100 (Advanced)
Bandwidth: 100MHz (Industry) ▲ 200MHz (Base) ▲▲ 300MHz (Advanced)		High current handling, good for analog signalsSensitive to temperature, larger size
Ball Grid Array (BGA) PackagesHigh-speed digital systemsPin Count: 100 (Industry) ▲ 200 (Base) ▲▲ 300 (Advanced)
Thermal Resistance: 0.5°C/W (Industry) ▲ 0.3°C/W (Base) ▲▲ 0.2°C/W (Advanced)		High pin density, excellent for complex ICsDifficult to inspect and repair
Ceramic Substrates/Heat SinksHigh-power electronicsThermal Conductivity: 100 W/mK (Industry) ▲ 150 W/mK (Base) ▲▲ 200 W/mK (Advanced)
Weight: 50g (Industry) ▲ 40g (Base) ▲▲ 30g (Advanced)		Efficient heat dissipation, durableAdds bulk, requires mounting hardware
Memory ICsData storage in devicesStorage Capacity: 1GB (Industry) ▲ 2GB (Base) ▲▲ 4GB (Advanced)
Read Speed: 100MB/s (Industry) ▲ 150MB/s (Base) ▲▲ 200MB/s (Advanced)		High capacity, fast accessVolatile types lose data when powered off

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