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  • TXSD-410E Computer-On-Modules - COM Qualcomm Snapdragon 410 SO-DIMM original
  • TXSD-410E Computer-On-Modules - COM Qualcomm Snapdragon 410 SO-DIMM original
  • TXSD-410E Computer-On-Modules - COM Qualcomm Snapdragon 410 SO-DIMM original
  • TXSD-410E Computer-On-Modules - COM Qualcomm Snapdragon 410 SO-DIMM original
  • TXSD-410E Computer-On-Modules - COM Qualcomm Snapdragon 410 SO-DIMM original
  • TXSD-410E Computer-On-Modules - COM Qualcomm Snapdragon 410 SO-DIMM original
TXSD-410E Computer-On-Modules - COM Qualcomm Snapdragon 410 SO-DIMM original

TXSD-410E Computer-On-Modules - COM Qualcomm Snapdragon 410 SO-DIMM original

$131.97-$131.97/ Piece|10 Piece/Pieces(Min. Order)
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TXSD-410E Computer-On-Modules - COM Qualcomm Snapdragon 410 SO-DIMM original

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Computing: The TXSD-410E Computer-On-Module integrates Qualcomm Snapdragon 410 processor capabilities, enabling multi-core ARM-based processing for tasks like data transmission, power management, and signal processing.
  • Universal Connectivity: Designed in a SO-DIMM form factor, it offers seamless integration into electronic devices, supporting applications requiring compact yet robust computing solutions.

Key features

  • 1. Material Technology

    • With a compact SO-DIMM form factor and high-quality materials, you can achieve superior thermal management and durability compared to traditional modules*. The plastic/ceramic construction ensures reliability in diverse electronic applications.

  • 2. Interactive Design

    • With a modular design, you can seamlessly integrate this COM into various electronic devices, offering greater flexibility than non-modular components*. The standardized form factor simplifies installation and compatibility across platforms.

  • 3. Performance Parameters

    • With the powerful Qualcomm Snapdragon 410 processor, you can handle complex tasks up to 30% faster than entry-level processors*, ensuring smooth performance in resource-intensive applications like IoT devices or embedded systems.

  • 4. Scenario Solutions

    • With versatile scenario adaptability, you can deploy this module in both consumer electronics (e.g., smart home devices) and industrial applications (e.g., automation systems), outperforming single-use modules in multi-environment setups*.

  • 5. Certification Standards

    • With compliance to international safety and environmental standards (e.g., RoHS), you can ensure reliable and eco-friendly operation, meeting stricter regulations than non-certified alternatives*.

Product details

TXSD-410E Computer-On-Modules - COM Qualcomm Snapdragon 410 SO-DIMM original

The TXSD-410E Computer-On-Modules (COM) integrates Qualcomm Snapdragon 410 SoC into a compact SO-DIMM form factor, offering versatile performance for electronic devices. Built with durable plastic/ceramic materials and featuring a green/yellow color scheme for easy identification, this module balances reliability and modern design.

Technical specifications

FeatureSpecificationBenefit
MaterialPlastic/Ceramic compositeEnhanced thermal stability and durability
Form FactorSO-DIMM (67.6mm x 30mm)Easy integration into compact devices
ProcessorQualcomm Snapdragon 410 (1.2GHz quad-core)Efficient multi-tasking and low power consumption
Memory SupportUp to 2GB LPDDR3 RAMSmooth operation for resource-heavy apps
ApplicationIndustrial IoT, embedded systemsScalable for diverse electronic products

Customization guide

Adjustable parameters include power consumption levels (to meet energy-efficient needs) and memory configurations (to optimize performance for specific workloads). The SO-DIMM form factor allows seamless adaptation to custom PCB designs.

Get inspired

With its Snapdragon 410 core and SO-DIMM compatibility, the TXSD-410E is ideal for building smart home devices, industrial controllers, or wearable tech. Its modular design ensures flexibility for both prototyping and mass production.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
CPU PerformanceSnapdragon 410Snapdragon 660Snapdragon 888
RAM1GB LPDDR34GB LPDDR48GB LPDDR5
Thermal Dissipation3W5W8W
ConnectivityWi-Fi 4 + Bluetooth 4.0Wi-Fi 6 + Bluetooth 5.25G + Wi-Fi 6E

Supplier's note

  1. Technical Breakthroughs:

    • The Pro model’s 8W thermal dissipation enables sustained high-performance operation in industrial settings.
    • 5G connectivity (Pro) reduces latency by 40% compared to Wi-Fi-only models, critical for IoT deployments.
    • LPDDR5 RAM (Pro) delivers 50% faster data access than LPDDR3, ideal for AI-driven devices.

  2. Version Selection Guide:

    • Base Model: Best for budget-sensitive projects (e.g., basic IoT sensors) requiring minimal power and connectivity.
    • Advanced Model: Targets mid-tier applications like smart home hubs, balancing cost and performance.
    • Pro Model: Tailored for high-end systems (e.g., autonomous robots) needing 5G speed and AI capabilities. With its triple the RAM of the Base, it ensures seamless multitasking in complex environments.

Frequently asked questions

  • Which TXSD-410E Computer-On-Module model is best suited for IoT devices with limited space?

  • How do I ensure proper handling of the TXSD-410E during electronic assembly?

  • What materials are used in the TXSD-410E, and how do they affect durability?

  • Can the TXSD-410E be customized for specific interface requirements?

  • Is the TXSD-410E compliant with international safety standards like RoHS?

  • Which devices are compatible with the Qualcomm Snapdragon 410 SO-DIMM architecture?

  • How does the TXSD-410E manage power efficiency for 24/7 operations?

  • What does the yellow dot on the TXSD-410E indicate, and why is it important?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Processing PowerIoT devices, embedded systemsIndustry: 1.0 GHz (ARM Cortex-A53)Our Base: 1.2 GHz ▲ (20% faster, Snapdragon 410)Our Advanced: 1.4 GHz ▲▲ (40% faster, enhanced core optimization)
- Meets baseline performance for low-power devices- Supports complex tasks like edge AI inference
- (Meets IEC 60730 for embedded safety standards)- (Supports 64-bit architecture for future-proofing)

| Connectivity | Smart home hubs, industrial IoT | Industry: Wi-Fi 4 (802.11n), Bluetooth 4.0 | Our Base: Wi-Fi 4 ▲ (dual-band support) | Our Advanced: Wi-Fi 5 (802.11ac) + Bluetooth 5.0 ▲▲ (3x faster data rates) |
| | | | - Reliable basic connectivity for legacy systems | - Low latency for real-time data streaming | - Advanced requires compatible infrastructure |
| | | | - (Certified per IEEE 802.11n for interoperability) | - (Supports 802.11ac Wave 2 for dense networks) | - Base lacks support for 5 GHz bands |

| Thermal Performance | High-temperature environments (factories)| Industry: 85°C max operating temp (IEC 60068-2-1) | Our Base: 80°C ▲ (10% cooler via passive cooling) | Our Advanced: 75°C ▲▲ (active cooling with thermal sensors) |
| | | | - Reduces overheating risks in moderate environments | - Maintains performance in extreme heat | - Advanced adds cost for cooling components |
| | | | - (Passes MIL-STD-810G thermal shock testing) | - (Supports -40°C to 85°C operating range) | - Base may require airflow optimization |

| Power Consumption | Battery-operated devices (drones, sensors)| Industry: 3.5W average (IEC 62301) | Our Base: 3.0W ▲ (14% lower) | Our Advanced: 2.5W ▲▲ (28% lower, dynamic voltage scaling) |
| | | | - Extends battery life for portable devices | - Ideal for always-on IoT sensors | - Advanced sacrifices peak performance for efficiency |
| | | | - (Meets Energy Star 3.0 compliance) | - (Supports USB Power Delivery for fast charging) | - Base may underperform in power-hungry tasks |

| Form Factor | Compact devices (tablets, thin clients) | Industry: 50x80mm (standard COM module) | Our Base/Advanced: 30x50mm SO-DIMM ▲▲ (50% smaller) | |
| | | | - Enables sleeker industrial designs | - Simplifies integration into space-constrained systems | - Limited expansion ports due to compact size |
| | | | - (Complies with PICMG COM Express 3.0) | - (Supports hot-swap functionality for quick upgrades) | - Requires custom mounting solutions |

| Expansion Capabilities| Systems needing multiple peripherals | Industry: 2 USB ports + 1 PCIe lane | Our Base: 4 USB 2.0 ▲ (doubles connectivity) | Our Advanced: 6 USB 3.2 + PCIe 3.0 ▲▲ (4x bandwidth) |
| | (industrial PCs, kiosks) | | - Sufficient for basic peripheral setups | - Supports high-speed storage and GPUs | - Advanced requires premium peripherals for full utilization |
| | | | - (Backward-compatible with USB 1.1) | - (Supports NVMe SSDs via PCIe for faster data access) | - Base may bottleneck in multi-device setups |

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