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  • TY93059P DIP-16 integrated circuit chip available from stock Electronic Component New IC TY93059
  • TY93059P DIP-16 integrated circuit chip available from stock Electronic Component New IC TY93059
  • TY93059P DIP-16 integrated circuit chip available from stock Electronic Component New IC TY93059
  • TY93059P DIP-16 integrated circuit chip available from stock Electronic Component New IC TY93059
  • TY93059P DIP-16 integrated circuit chip available from stock Electronic Component New IC TY93059
  • TY93059P DIP-16 integrated circuit chip available from stock Electronic Component New IC TY93059
TY93059P DIP-16 integrated circuit chip available from stock Electronic Component New IC TY93059

TY93059P DIP-16 integrated circuit chip available from stock Electronic Component New IC TY93059

$0.47-$0.95/ Piece|1 Piece/Pieces(Min. Order)
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TY93059P DIP-16 integrated circuit chip available from stock Electronic Component New IC TY93059

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit Functionality: The TY93059P is a 20-pin SOP (Small Outline Package) surface-mount integrated circuit (IC) designed for digital and mixed-signal applications. It enables compact PCB layouts and efficient connectivity in electronic devices.
  • Versatile Connectivity: The 20-pin configuration supports a wide range of functions, including microcontroller interfaces, memory management, and signal processing, tailored to specific circuit requirements.

Key features

  • 1. Material Technology

    • With a corrosion-resistant black plastic body and tin-lead alloy pins, you can ensure durable performance in demanding electronic environments. The robust construction withstands thermal and mechanical stress during soldering and operation.

  • 2. Interactive Design

    • With a surface-mount design, you can achieve up to 40% smaller PCB footprints compared to through-hole components*, enabling compact device layouts. This design streamlines manufacturing and enhances space efficiency in modern electronics.

  • 3. Performance Parameters

    • With a 20-pin configuration, you can support complex functions and high connectivity requirements for digital and mixed-signal applications. The package balances pin density with physical size for versatile integration.

  • 4. Scenario Solutions

    • Designed for compact consumer electronics and industrial systems, you can integrate this IC into space-limited devices for enhanced functionalities. Ideal for applications like microcontrollers, memory modules, and embedded systems requiring advanced circuitry.

  • 5. Certification Standards

    • With compliance to international quality standards (e.g., ISO), you can ensure reliable performance and safety in electronic systems*. This certification ensures adherence to global manufacturing and safety protocols.

Product details

TY93059P DIP-16 integrated circuit chip available from stock Electronic Component New IC TY93059

The TY93059P DIP-16 integrated circuit chip is a versatile surface-mount IC designed for compact, high-performance applications. Available in stock, this 20-pin SOP (Small Outline Package) features a durable black plastic body with tin-plated leads, ensuring reliable soldering and long-term stability. Ideal for digital circuits, microcontrollers, and mixed-signal systems, it combines space efficiency with robust functionality.

Technical specifications

FeatureSpecificationBenefit
Package TypeSOP-20 (Small Outline Package)Space-efficient design for dense PCB layouts
Pin Configuration20 pins (2 rows of 10)Supports complex circuit connectivity
MaterialBlack plastic body, tin-plated leadsEnhanced solderability and durability
Operating Temperature-40°C to +85°CReliable performance in harsh environments
CertificationRoHS compliantMeets global environmental standards

Customization guide

Adjustable parameters include pin spacing and lead finish to accommodate specialized PCB designs or environmental requirements. For high-vibration applications, reinforced lead anchoring can be added.

Get inspired

With its SOP-20 package, the TY93059P enables sleek, high-density circuit board designs. Whether you’re building a microcontroller-based IoT device or a mixed-signal sensor system, this IC delivers the reliability and flexibility needed for modern electronics.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temperature-40°C to +85°C-55°C to +125°C-55°C to +150°C
Power Consumption150 mW120 mW (-20%)90 mW (-40%)
Pin Count20 pins28 pins (+40%)40 pins (+100%)
CertificationRoHSRoHS + AEC-Q100RoHS + MIL-STD-883

Supplier's note

  1. Technical Breakthroughs:

    • Thermal Performance: The Pro Model’s expanded temperature range (-55°C to +150°C) enables use in automotive and aerospace systems.
    • Low Power: The Advanced Model’s 120 mW consumption reduces energy waste in battery-powered devices.
    • Scalability: The Pro Model’s 40-pin configuration supports complex FPGA and ASIC integration.

  2. Optimal Version Selection:

    • Base Model: Ideal for standard consumer electronics (e.g., IoT sensors) requiring cost-effective, reliable performance.
    • Advanced Model: Suited for industrial applications needing lower power and automotive-grade certification (AEC-Q100).
    • Pro Model: Best for high-reliability sectors like aerospace, where extreme temperatures and MIL-STD-883 compliance are critical.

With the Pro Model’s 40-pin capacity, you can design advanced systems with multi-channel signal processing. The Advanced Model’s 20% lower power consumption ensures longer battery life in portable devices. Choose wisely based on your application’s environmental and scalability needs.

Frequently asked questions

  • Which applications are suitable for the TY93059P SOP-20 surface-mount integrated circuit?

  • How do I ensure proper soldering for the TY93059P’s metallic leads?

  • What materials make the TY93059P IC durable for industrial use?

  • Can the TY93059P SOP-20 IC be customized for specific functions?

  • Is the TY93059P compliant with industry standards for electronic components?

  • What advantages does the SOP-20 package offer over DIP-16 for PCB design?

  • Are there stock TY93059P ICs available for bulk orders?

  • How does the TY93059P’s pinout support mixed-signal applications?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypePrototyping, educational projectsIndustry Standard: DIP-16 (Through-hole)
Our Base: DIP-16 (Through-hole)
Our Advanced: SOP-20 (Surface-mount ▲▲)		Base: Easier manual assembly (ideal for prototyping)
Advanced: Compact design (saves 40% PCB space ▲)		Industry/Base: Larger footprint (requires 25% more board area)
Advanced: Requires SMT assembly (ISO 9804)
Pin CountHigh-density I/O applicationsIndustry Standard: 16 pins
Our Base: 16 pins
Our Advanced: 20 pins (▲▲)		Advanced: Supports 25% more I/O interfaces (enables complex circuits)Industry/Base: Limited connectivity for modern systems
Material CompositionMass production, environmental complianceIndustry Standard: Plastic body + tin-lead leads
Our Base: Same as industry
Our Advanced: Lead-free SnAgCu (RoHS ▲)		Advanced: 100% RoHS compliant (no hazardous materials)Industry/Base: Contains lead (not suitable for EU markets)
Thermal PerformanceHigh-heat environmentsIndustry Standard: 85°C max operating temp
Our Base: 85°C
Our Advanced: 125°C (▲▲)		Advanced: Operates in extreme conditions (e.g., automotive systems)Industry/Base: Risk of thermal throttling in compact devices
Chemical ResistanceIndustrial automationIndustry Standard: Withstands 50+ chemicals (ASTM D543)
Our Base: Same as industry
Our Advanced: 100+ chemicals (▲)		Advanced: Resists aggressive solvents (e.g., in chemical plants)Industry/Base: Vulnerable to prolonged exposure to corrosives
Operating TemperatureExtreme-temperature applicationsIndustry Standard: -40°C to +85°C
Our Base: Same as industry
Our Advanced: -55°C to +125°C (▲▲)		Advanced: Functions in cryogenic or high-heat settings (e.g., aerospace)Industry/Base: Limited use in harsh environments

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