All categories
Featured selections
Trade Assurance
Buyer Central
Help Center
Get the app
Become a supplier

The Best Quality bisphenol a type epoxy resin High purity epoxy resin for wholesale export

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Purity Epoxy Resin: Designed for precise bonding and coating in electronics manufacturing, ensuring reliability in sensitive applications.
  • Dual-Component Adhesive System: Offers strong adhesion and chemical resistance, ideal for complex assembly processes requiring durability.

Key features

  • 1. Corrosion-Resistant Material Technology

  • With a high-purity bisphenol A epoxy resin formulation, ensure durable adhesion and chemical resistance in demanding environments. The metal drum packaging with corrosion-resistant coating protects the resin during storage and transport, outperforming plastic containers in harsh industrial settings.*

  • 2. User-Friendly Dual-Component System

  • With a precise dual-component adhesive system, achieve consistent bonding strength through easy mixing and application, reducing errors compared to single-component alternatives.*

  • 3. Low Viscosity for Versatile Performance

  • With a low-viscosity design, penetrate complex surfaces and tight gaps effortlessly, enabling 20% faster application than thicker adhesives in electronics assembly.*

  • 4. Optimized for Electronics Applications

  • Designed for electronics manufacturing, this epoxy resin ensures reliable performance in high-stress scenarios like circuit board assembly, minimizing downtime and defects.*

  • 5. Compliance with Industry Standards

  • Certified to meet international safety and quality standards for electronic components, ensuring compliance with regulatory requirements for export markets.*

Product details

The Best Quality bisphenol a type epoxy resin High purity epoxy resin for wholesale export

The Best Quality bisphenol A type epoxy resin is a high-purity, dual-component adhesive system designed for precision applications in electronics and industrial settings. Its low-viscosity formulation ensures smooth application, while its robust chemical resistance and customizable properties make it ideal for demanding environments.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialHigh-purity bisphenol A epoxy resinElectronics assembly, chemical coatings
Viscosity2000–3000 mPa·s (low viscosity)Precision bonding in circuit boards
OdorAdjustable (low/high)Open workshops or enclosed manufacturing
Curing Time24 hours at 25°C (adjustable)Large-scale industrial production lines
Chemical ResistanceMeets ASTM D429 for adhesionCorrosive environments in chemical plants

Customization guide

Adjustable parameters include viscosity (via diluent ratios) and odor levels (low for sensitive environments or high for rapid curing). Customizable curing schedules and mixed-component ratios can meet specialized needs like aerospace or medical-grade applications.

Get inspired

With its low-viscosity formula, this epoxy resin simplifies intricate electronics assembly. For instance, its smooth flow ensures uniform coatings on printed circuit boards (PCBs), while its chemical resistance safeguards components against harsh solvents.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Viscosity2000–3000 mPa·s1500–2000 mPa·s (+25% flow)1000–1500 mPa·s (+50% flow)*
Curing Time24h @25°C12h @25°C (50% faster)6h @25°C (75% faster)
Tensile Strength30 MPa40 MPa (+33%)55 MPa (+83%)

Supplier's note

  1. Breakthrough Features:

    • Low Viscosity: Enables precise application in electronics without drips.
    • ASTM D429 Compliance: Ensures adhesion in corrosive chemical environments.
    • Adjustable Curing: Reduces downtime by 75% in Pro Model for high-volume production.
  2. Version Selection Guide:

    • Base Model: Ideal for standard electronics assembly (e.g., PCBs) where moderate curing speed suffices.
    • Advanced Model: Suitable for automotive or industrial users needing faster curing (e.g., automotive part bonding).
    • Pro Model: Best for aerospace or medical industries requiring ultra-fast curing and extreme tensile strength.

Example Use Case: The Pro version’s 6-hour curing time (75% faster than Base) paired with 55 MPa tensile strength allows aerospace engineers to rapidly bond lightweight composites without compromising structural integrity.

Frequently asked questions

  • Which epoxy resin model is best for electronics assembly applications?

  • How does bisphenol A epoxy resin compare to other resins in electronics manufacturing?

  • How should I store epoxy resin to maintain its properties during wholesale export?

  • Is the epoxy resin FDA-approved or meet international safety standards for electronic components?

  • Can the viscosity of bisphenol A epoxy resin be customized for specific electronics bonding needs?

  • Does this epoxy resin have thermal stability for high-temperature electronic components?

  • Does the epoxy resin have low odor for indoor electronics manufacturing environments?

  • What are the key features of double component epoxy resin for electronics assembly?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
ViscosityElectronics assembly,精密涂布Our Advanced: 200-500 cP (ISO 2812) ▲▲▲
Base: 500-1000 cP ▲
Industry: 1000-2000 cP
Easier application in microelectronics
Reduced air bubbles (Advanced)
Higher cost for Advanced tier
Curing TimeRapid prototyping, on-site repairsAdvanced: 2h (with accelerators) ▲▲▲
Base: 12h ▲
Industry: 24h
Accelerates production cycles (Advanced)Requires heat/accelerants for fast curing
Chemical ResistanceIndustrial chemical storage, automotiveAdvanced: Withstands 50+ chemicals (ASTM D543) ▲▲▲
Base: 30+ chemicals ▲
Industry: 20+ chemicals
Resists harsh solvents and acids (Advanced)Higher material cost
Odor LevelCleanroom, food-grade environmentsAdvanced: Low odor (<100 ppb VOC, ASTM E1732) ▲▲
Base: Moderate odor ▲
Industry: High odor
Safe for sensitive environments (Advanced)Limited availability in high-odor variants
Adhesion StrengthStructural bonding, aerospace componentsAdvanced: 12 MPa (ASTM D903) ▲▲
Base: 8 MPa ▲
Industry: 5 MPa
Stronger joint durability (Advanced)Requires surface prep for optimal bonding
Temperature RangeExtreme environments (e.g., aerospace)Advanced: -50°C to 200°C (ASTM D696) ▲▲▲
Base: -30°C to 150°C ▲
Industry: 0°C to 120°C
Operates in cryogenic/high-heat conditions (Advanced)Brittle at extremes in Base tier

Related searches

The Product Description is generated by third-party, and Alibaba.com is not liable for any risks related to inaccuracies or the infringement of third-party rights.

The information in this Product Description may differ from the details on the product listing page on Alibaba.com. Additionally, the contents may not be updated in real-time with the product listing page on Alibaba.com, and there may be delays in reflecting the most updated information. The description on product listing page takes precedence. You shall not rely on this Product Description in making transaction decisions.

The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.