Material Composition | Electronics soldering, semiconductor manufacturing | Industry Standard: Alloyed metals (e.g., tin-lead, ASTM B32-18) Our Base: Non-alloy pure tin (99.99% Sn, ISO 945-1) Our Advanced: Non-alloy with 99.999% purity (SEM 12-90) | ▲ Base: Avoids alloy impurities for superior conductivity. ▲▲ Advanced: Ultra-pure for critical applications like aerospace. | Industry Standard may introduce impurities; Base/Advanced cost 20–30% higher than alloys. |
Purity Level | High-end electronics, medical devices | Industry Standard: 99.95% (ASTM B32-18) Our Base: 99.99% (ISO 945-1) Our Advanced: 99.999% (SEM 12-90) | ▲ Base reduces defects in circuit boards by 40% ▲▲ Advanced meets SEMI F57 for semiconductor-grade use. | Base costs 15% more than industry standard; Advanced is niche and expensive. |
Weight & Density | Aerospace, automotive lightweighting | Industry Standard: Lead (11.3 g/cm³) Our Base: Tin (7.3 g/cm³) Our Advanced: Tin + graphite composite (6.8 g/cm³) | ▲ Base 35% lighter than lead for fuel efficiency. ▲▲ Advanced further reduces weight for advanced composites. | Base less dense than aluminum (2.7 g/cm³) for some structural uses. |
Corrosion Resistance | Marine, humid environments | Industry Standard: Steel (ASTM A380) Our Base: Pure tin (resists oxidation, ISO 20400) Our Advanced: Tin with Ni plating (ASTM B435) | ▲ Base outperforms steel in saltwater tests (90% less corrosion). ▲▲ Advanced withstands 500+ hours in acid fog (ASTM B117). | Base requires storage in dry conditions; Advanced adds coating cost. |
Melting Point | Low-temperature soldering | Industry Standard: Lead (327°C) Our Base: Tin (232°C) Our Advanced: Tin-bismuth alloy (138°C) | ▲ Base safe for heat-sensitive components (e.g., PCBs). ▲▲ Advanced enables ultra-low-temperature assembly (▲▲). | Base less durable than lead in high-temp applications. |
Cost Efficiency | Mass production, cost-sensitive projects | Industry Standard: Alloyed tin (USD $12/kg) Our Base: Pure tin (USD $18/kg) Our Advanced: Ultra-pure tin (USD $35/kg) | ▲ Base reduces long-term failure costs by 25% in electronics. ▲▲ Advanced lowers rework costs in semiconductors (▲▲). | Base/Advanced upfront costs 50–180% higher than industry standard. |