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  • UV Curable Etching Resistant Plating Resist for PCB Circuit
  • UV Curable Etching Resistant Plating Resist for PCB Circuit
  • UV Curable Etching Resistant Plating Resist for PCB Circuit
  • UV Curable Etching Resistant Plating Resist for PCB Circuit
  • UV Curable Etching Resistant Plating Resist for PCB Circuit
UV Curable Etching Resistant Plating Resist for PCB Circuit

UV Curable Etching Resistant Plating Resist for PCB Circuit

  • 1 - 99 Kilograms
    $13
  • 100 - 199 Kilograms
    $10.50
  • 200 - 499 Kilograms
    $10
  • >= 500 Kilograms
    $9.50

UV Curable Etching Resistant Plating Resist for PCB Circuit

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • UV-Curable Plating Resist: Designed to protect printed circuit board (PCB) circuits during etching processes by forming a durable, etching-resistant barrier.
  • Solvent-Based Screen Printing Ink: Specifically formulated for screen printing applications on metal surfaces, ensuring precise adhesion and durability in PCB manufacturing.

Key features

  • 1. UV-Curable Etching-Resistant Material Technology

  • With UV-curable etching-resistant material, achieve durable plating resist for precise PCB circuit patterns. This formulation withstands harsh chemical etching processes, ensuring circuit integrity during manufacturing.

  • 2. Rapid UV Curing Performance

  • With rapid UV curing, reduce production time by up to 40% compared to conventional heat-drying inks* [*Disclaimer: Based on internal testing; actual results may vary]. Ideal for high-volume PCB manufacturing workflows.

  • 3. Industrial PCB Manufacturing Scenario Solution

  • Designed for industrial PCB manufacturing, maintain circuit integrity during etching processes to minimize defects and rework. Optimized for consistent performance in commercial-scale production environments.

  • 4. Screen Printing Compatibility

  • With optimized viscosity for screen printing, ensure even coating and sharp circuit definition without clogging. Compatible with standard screen printers, simplifying integration into existing workflows.

  • 5. Compliance with Electronics Industry Standards

  • Complies with industry standards for chemical resistance and safety in PCB applications, ensuring reliability and adherence to quality benchmarks for electronics manufacturing.

Product details

UV Curable Etching Resistant Plating Resist for PCB Circuit

The UV Curable Etching Resistant Plating Resist for PCB Circuit is a solvent-based ink designed for precision screen printing on metal surfaces. Its UV-curable formula ensures rapid curing and chemical resistance, making it ideal for PCB manufacturing processes requiring durable plating resists.

Technical specifications

FeatureSpecificationBenefit
Material TypeSolvent-based inkHigh adhesion to metal surfaces
Curing MethodUV light-curable (LB-1618UV-1)Fast curing for efficient production
ApplicationPCB circuit plating resistProtects circuits during etching
ViscosityAdjustable (200–400 cps)Customizable for precise layer thickness
Adhesion Strength>5N/cm² on metalWithstands harsh chemical etching baths

Customization guide

Adjustable viscosity and curing time parameters allow customization to meet specific production needs. For example, lower viscosity suits fine-line printing, while higher viscosity accommodates thick-layer applications.

Get inspired

Ideal for PCB manufacturers needing a reliable plating resist that combines UV-curing speed with etching resistance. Simplify circuit protection workflows with a material designed to withstand aggressive chemical processes.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Curing Speed60 sec @360nm+15% faster*+30% faster*
Adhesion Strength5N/cm²6.5N/cm²8N/cm²
Viscosity Range200–300 cps200–350 cps200–400 cps
Chemical ResistanceStandardEnhancedTriple-industry**

Supplier's note

  1. Technical Breakthroughs:

    • UV Curing Efficiency: The Pro model’s curing speed is 20% faster than traditional UV inks, reducing downtime.
    • Adhesion: The Advanced model’s 6.5N/cm² adhesion exceeds industry standards, ensuring durability in harsh etching baths.
    • Viscosity Control: Adjustable viscosity (up to 400 cps) enables precise layering for intricate PCB designs.
  2. Optimal Version Selection:

    • Base Model: Suitable for small-scale PCB shops prioritizing cost-effectiveness.
    • Advanced Model: Ideal for medium-volume production requiring enhanced adhesion and viscosity flexibility.
    • Pro Model: Recommended for high-volume manufacturers needing ultra-fast curing and triple-industry chemical resistance for complex etching processes.

*Compared to standard UV inks. **Exceeds ISO 2812-10 certification by 300%.

Frequently asked questions

  • Which UV curable ink is best suited for screen printing on PCB circuits?

  • How do I clean screen printing equipment after using solvent-based PCB plating resist?

  • What makes solvent-based UV curable ink better than water-based options for metal PCBs?

  • Can this UV curable plating resist be customized for specific PCB circuit requirements?

  • Is this UV curable ink compliant with RoHS standards for electronic components?

  • What are the ideal curing conditions for PCB plating resist in UV curing systems?

  • How does this ink resist etching during PCB manufacturing processes?

  • What storage conditions ensure the longevity of UV curable PCB plating resist?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
UV-Curable InkRapid PCB prototypingCures in 3 seconds under 365nm UV (ISO 21344) ▲▲▲Enables same-day turnaround for prototypesRequires UV curing equipment (e.g., $5k+ investment)
Etching ResistanceMulti-layer PCB manufacturingWithstands 12+ etching cycles (ASTM B322) ▲▲Reduces rework by 40% in complex circuits20% higher cost vs standard inks
Plating ResistGold plating on circuit tracesMaintains adhesion at 260°C (IPC-4101) ▲Ensures uniform plating thickness (±5µm tolerance)Limited use beyond 260°C (e.g., high-temperature soldering)
Solvent-Based FormulaOutdoor signage production70%+ solvent content for metal adhesion (ASTM D5404) ▲▲Bonds to rough or corroded surfacesSlower drying time in humid environments (adds 20% cycle time)
Drying TimeHigh-volume PCB assembly90 seconds air dry (vs industry standard 180s) ▲▲▲Reduces line downtime by 50%Requires climate-controlled environments to prevent premature curing
Mesh CompatibilityFine-line circuit printingWorks with 300+ mesh counts (ASTM D1417) ▲▲Enables 0.05mm trace resolutionNeeds precision mesh calibration (adds 1hr setup time per batch)

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.