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  • Wafer or Plananr WS2 Tungsten Sulfide Alloy Sputtering Target for Thin Film Coating
  • Wafer or Plananr WS2 Tungsten Sulfide Alloy Sputtering Target for Thin Film Coating
  • Wafer or Plananr WS2 Tungsten Sulfide Alloy Sputtering Target for Thin Film Coating
  • Wafer or Plananr WS2 Tungsten Sulfide Alloy Sputtering Target for Thin Film Coating
  • Wafer or Plananr WS2 Tungsten Sulfide Alloy Sputtering Target for Thin Film Coating
  • Wafer or Plananr WS2 Tungsten Sulfide Alloy Sputtering Target for Thin Film Coating
Wafer or Plananr WS2 Tungsten Sulfide Alloy Sputtering Target for Thin Film Coating

Wafer or Plananr WS2 Tungsten Sulfide Alloy Sputtering Target for Thin Film Coating

  • 1 - 9 Kilograms
    $110
  • >= 10 Kilograms
    $55

Customization:

Customized logo(Min.Order: 10 pieces)

Wafer or Plananr WS2 Tungsten Sulfide Alloy Sputtering Target for Thin Film Coating

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Sputtering Target for Thin Film Coating: Designed to deposit high-performance thin films onto substrates, leveraging the WS₂ alloy's unique properties for enhanced durability, conductivity, and thermal stability.
  • Material Composition: The tungsten sulfide alloy ensures corrosion resistance and uniform coating distribution, ideal for precision applications requiring consistent film quality.

Key features

  • 1. Material Technology

  • With a tungsten sulfide (WS₂) alloy composition, achieve durable thin film coatings with enhanced corrosion resistance and wear resistance. Compared to pure tungsten targets, this alloy offers improved thermal stability for consistent performance.

  • 2. Interactive Design

  • With its flat, circular design, seamlessly integrate into standard sputtering systems for precise alignment and efficient operation. Engineered for compatibility with common deposition equipment, reducing setup time and complexity.

  • 3. Performance Parameters

  • With high-purity WS₂ alloy construction, ensure uniform thin film thickness and superior adhesion on substrates. Achieve up to 15% higher film uniformity compared to standard alloy targets.

  • 4. Scenario Solutions

  • Engineered for continuous operation in industrial coating processes, this target maintains performance under high vacuum conditions. Ideal for semiconductor and optical coating applications requiring 24/7 reliability.

  • 5. Certification Standards

  • Manufactured to meet ISO 9001 quality standards, ensuring material purity and dimensional accuracy for precision applications. Certified for use in critical thin film deposition systems.

Product details

Wafer or Plananr WS2 Tungsten Sulfide Alloy Sputtering Target for Thin Film Coating

The Wafer or Planar WS₂ Tungsten Sulfide Alloy Sputtering Target is a precision-engineered component designed for thin film coating applications. Crafted from a durable tungsten sulfide alloy, it features a smooth, uniform surface ideal for high-precision deposition processes. Its robust material composition ensures reliability in demanding industrial environments.

Technical specifications

FeatureSpecificationBenefit
MaterialTungsten sulfide (WS₂) alloyHigh thermal conductivity and corrosion resistance
Surface FinishSmooth, matte, uniform dark grayEnsures uniform thin film deposition
ApplicationThin film coating, semiconductor manufacturingOptimized for precision coating processes

Customization guide

Adjustable parameters such as thickness, diameter, and surface treatment can be tailored to meet specific coating requirements. For instance, increasing the target thickness improves durability in high-volume production scenarios.

Get inspired

With its low friction coefficient and chemical stability, the WS₂ alloy enables high-performance coatings for aerospace, electronics, and optical components. Whether you need anti-wear coatings for machinery or conductive layers for semiconductors, this target delivers consistent results.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Purity99.9%99.95%99.99%
Thickness2mm3mm5mm
Max Diameter50mm100mm200mm
Thermal Conductivity150 W/m·K180 W/m·K (+20%)220 W/m·K (+46%)

Supplier's note

  1. Technical Breakthroughs:

    • High-Purity Alloy: The Pro Model’s 99.99% purity ensures ultra-clean coatings for semiconductor applications.
    • Enhanced Thermal Conductivity: The Pro Model’s 220 W/m·K rating outperforms industry standards by 46%, enabling faster heat dissipation during sputtering.
    • Scalable Dimensions: The 200mm diameter Pro Model supports large-area coating systems, reducing production downtime.
  2. Optimal Version Selection:

    • Base Model: Ideal for small-batch R&D or standard coating tasks where cost efficiency is prioritized.
    • Advanced Model: Suitable for mid-scale production requiring improved durability and larger coating areas.
    • Pro Model: Designed for high-volume, mission-critical applications (e.g., semiconductor manufacturing) where purity and thermal performance are critical.

With the Pro Model’s 99.99% tungsten sulfide alloy, you can achieve contaminant-free coatings for next-gen electronics. Its 220 W/m·K thermal conductivity ensures stable operation in high-power sputtering systems, outperforming traditional targets by 20% or more. Pair this with its 200mm diameter, and you reduce the need for multiple targets in large-scale production.

Frequently asked questions

  • Which WS2 sputtering target is best suited for thin film coating in semiconductor manufacturing?

  • How do I clean the WS₂ tungsten sulfide alloy sputtering target after use to maintain performance?

  • How does WS₂ alloy compare to pure tungsten for sputtering targets in terms of wear resistance?

  • Can the WS₂ sputtering target be customized for specific substrate sizes or thickness requirements?

  • Is the WS₂ tungsten sulfide alloy sputtering target RoHS-compliant and suitable for aerospace coatings?

  • What makes the WS₂ alloy sputtering target suitable for high-precision thin film applications?

  • What storage conditions prevent oxidation of the WS₂ sputtering target before use?

  • Does the WS₂ alloy sputtering target require pre-treatment before use in reactive sputtering?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Pure Tungsten TargetElectronics, aerospace componentsMaterial purity: 99.95% (ASTM F1580)
Surface roughness: Ra <0.8 µm (ISO 4287)
High thermal conductivity, durableHigher cost, requires backing for thick coatings
Tungsten Carbide (WC)Cutting tools, wear-resistant partsHardness: HV 1400+ (ASTM E9)
Density: 15.6 g/cm³
Extremely hard, wear-resistantBrittle, prone to cracking under stress
Tungsten Nitride (WN)Corrosion protection, wear coatingsHardness: HV 2000+ (ASTM E9)
Corrosion resistance: Passivated (ASTM B117)
High hardness, corrosion resistanceHigh cost, limited availability
Tungsten Sulfide (WS2)Lubricious coatings, low frictionFriction coefficient: 0.08 (Industry) → 0.05 (Our Base)▲ → 0.03 (Our Advanced)▲▲
Ra <0.5 µm (ISO 4287)
Lowest friction, thermal stability up to 500°C (ASTM G99 compliant)May degrade in oxidizing environments
Molybdenum-backed TungstenThick film coatingsAdhesion strength: 50 MPa (ASTM D4141)
Backing material: Mo 99.95%
Enables thick coatings without warpingComplex manufacturing, higher cost
Custom Tungsten AlloySpecialty applicationsAlloy composition: 80% W + 20% Ni (customizable)
Density: 17.5 g/cm³
Tailored properties for specific needsRequires precise alloying, variable performance across batches

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