Material Quality | Industrial Equipment, High-Temperature Environments | Industry Standard: FR-4 (Tg 130°C) Our Base: FR-4 (Tg 140°C) Our Advanced: FR-4 + Copper Clad (Tg 155°C ▲) | ▲ Advanced: 25% higher thermal stability (prevents warping at 150°C+) | Base: 10% heavier than standard; Advanced: 30% cost premium due to cladding |
Signal Integrity | High-Speed Data Systems, 5G Infrastructure | Industry Standard: 4-layer PCB, 100MHz max freq. Our Base: 6-layer PCB, 500MHz ▲ Our Advanced: 8-layer PCB, 1GHz ▲ | ▲ Advanced: 10x faster signal transmission (supports GHz-level applications) | Base: 20% higher cost vs standard; Advanced: Requires specialized assembly tools |
Thermal Management | High-Power Devices, Server Hardware | Industry Standard: 1.5W/mK thermal conductivity, passive cooling Our Base: 2.0W/mK + heat sinks ▲ Our Advanced: 3.0W/mK + active cooling ▲ | ▲ Advanced: 50% better heat dissipation (operates at 85°C ▲) | Base: Adds 15% weight; Advanced: Requires external cooling systems |
Chemical Resistance | Harsh Industrial Environments | Industry Standard: ASTM D543 (20 chemical exposures) Our Base: ASTM D543 (30 exposures ▲) Our Advanced: ASTM D543 (50 exposures ▲) | ▲ Advanced: 2.5x longer lifespan in corrosive environments | Base: 10% higher cost; Advanced: 25% cost increase due to protective coatings |
Customization Capability | IoT Devices, Custom Electronics | Industry Standard: Limited components (50+) Our Base: Moderate (100+ ▲) Our Advanced: High flexibility (200+ ▲) | ▲ Advanced: Supports complex SoC layouts (e.g., microcontroller arrays) | Base: 15% longer lead time; Advanced: Requires advanced design software |
Surface Finish | High-Reliability Systems | Industry Standard: HASL (solderability score 8/10) Our Base: ENIG (9/10 ▲) Our Advanced: Immersion Silver (10/10 ▲) | ▲ Advanced: 20% better solder joint reliability (ASTM F1249 compliant) | Base: 20% cost increase; Advanced: 40% premium for premium finish |