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  • X9312ZP DIP8 new OriginalBOM Inventory Supporting Service X9312ZP Chip ic
  • X9312ZP DIP8 new OriginalBOM Inventory Supporting Service X9312ZP Chip ic
  • X9312ZP DIP8 new OriginalBOM Inventory Supporting Service X9312ZP Chip ic
  • X9312ZP DIP8 new OriginalBOM Inventory Supporting Service X9312ZP Chip ic
  • X9312ZP DIP8 new OriginalBOM Inventory Supporting Service X9312ZP Chip ic
  • X9312ZP DIP8 new OriginalBOM Inventory Supporting Service X9312ZP Chip ic
X9312ZP DIP8 new OriginalBOM Inventory Supporting Service X9312ZP Chip ic

X9312ZP DIP8 new OriginalBOM Inventory Supporting Service X9312ZP Chip ic

$0.22-$1.10/ Piece|10 Piece/Pieces(Min. Order)
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X9312ZP DIP8 new OriginalBOM Inventory Supporting Service X9312ZP Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit (IC) Functionality: The X9312ZP DIP8 chip serves as a versatile integrated circuit designed for signal processing, power management, and control systems. Its eight-pin DIP package enables compact yet robust connectivity in electronic devices.
  • OriginalBOM Inventory Support: Provides seamless compatibility with existing designs and inventory management, ensuring reliable sourcing and replacement for critical applications.

Key features

  • 1. Durable Material Technology

    • With a corrosion-resistant metal lead design and robust plastic housing, you can ensure reliable performance in diverse environmental conditions*.

  • 2. Standardized Interactive Design

    • The standardized DIP8 packaging allows for seamless integration into circuit boards, reducing assembly time by up to 30% compared to non-standardized ICs*.

  • 3. Optimized Performance Parameters

    • With low-power consumption capabilities, you can achieve energy savings of up to 20% compared to traditional IC solutions*.

  • 4. Versatile Scenario Solutions

    • Suitable for applications ranging from prototyping to commercial electronics, this chip adapts to tasks like power management and signal processing compared to single-function ICs*.

  • 5. Compliance with Industry Standards

    • Complies with standard certifications for electronic components, ensuring safety and reliability unlike uncertified alternatives*.

Product details

X9312ZP DIP8 new OriginalBOM Inventory Supporting Service X9312ZP Chip ic

The X9312ZP DIP8 IC chip is a versatile integrated circuit designed for electronic devices requiring reliable signal processing, power management, or control systems. With its DIP8 package and robust construction, this chip offers a balance of functionality and durability, supporting applications from consumer electronics to industrial control systems.

Technical specifications

FeatureSpecificationBenefit
MaterialPlastic housing with metal (Cu alloy) leadsDurable, lightweight, and corrosion-resistant packaging
Package TypeDIP-8 (Dual In-line Package)Easy insertion into PCBs for simplified assembly
Pin Count8 pinsCompact yet functional for low-power circuits
Compliance StandardsRoHS, ISO 9001Ensures environmental and quality compliance
Operating Temperature-40°C to +85°CReliable performance in extreme environments

Customization guide

Adjustable parameters include pin configuration spacing and lead material (e.g., gold-plated leads for high-reliability applications) to meet specialized needs such as enhanced thermal conductivity or EMI shielding.

Get inspired

The X9312ZP DIP8’s modular design makes it ideal for prototyping, IoT devices, or industrial automation. Its compatibility with standard PCB layouts simplifies integration into existing systems while maintaining high reliability.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Voltage3.3V to 5V+15% (up to 5.8V)+30% (up to 6.5V)
Current Rating200mA230mA260mA
Temperature Range-40°C to +85°CExtended +10°CExtended +20°C

Supplier's note

  1. Technical Breakthroughs:

    • Material Innovation: The Cu alloy leads offer 20% better thermal conductivity than standard DIP packages, enhancing heat dissipation.
    • Compliance Standards: Full RoHS and ISO 9001 certification ensures seamless adoption in global markets.
    • Temperature Tolerance: The Pro Model’s expanded range (-20°C to +105°C) enables use in harsh industrial environments.

  2. Optimal Version Selection:

    • Base Model: Ideal for basic consumer electronics (e.g., remote controls) where standard voltage and temperature ranges suffice.
    • Advanced Model: Suited for industrial sensors or automotive systems requiring 15% higher voltage tolerance.
    • Pro Model: Best for extreme applications like aerospace or heavy machinery, leveraging its tripled chemical resistance (vs. industry benchmarks) and extended thermal stability.

With the Pro Model’s expanded temperature range, you can ensure uninterrupted operation in outdoor equipment. Pair its gold-plated leads with high-vibration scenarios to maintain signal integrity. For prototyping, the Base Model’s ease of PCB integration reduces development time.

Frequently asked questions

  • Which applications are suitable for the X9312ZP DIP8 chip?

  • How to properly store DIP8 chips like the X9312ZP to prevent damage?

  • Why choose DIP8 packaging over other IC types for my project?

  • Does the X9312ZP support customization for specific functions?

  • Is the X9312ZP DIP8 compliant with industry standards?

  • What circuit boards are compatible with the X9312ZP DIP8?

  • How do I install the X9312ZP DIP8 into a circuit board?

  • What support services are available for X9312ZP chips?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
DIP (Dual In-line)Prototyping, educational projects8 pins (IEC 61187), Plastic housing (ASTM D635 HB), Operating Temp: -40°C to +125°C (MIL-STD-883 ▲)Easy manual handling (IPC-A-610 Class 2), Visible components for inspectionLarger footprint vs QFN/BGA, Higher profile (3.9mm)
QFN (Quad Flat No-leads)High-density boards, IoT devicesLeadless design (IEC 61187), Thermal pad (IPC-7351), 0.5mm pitch (IPC-7351)Compact size (2x2mm), Better thermal performance (▲ vs DIP)Sensitive to moisture (J-STD-020), Difficult to inspect solder joints
SOP (Small Outline)Consumer electronics, moderate density14-44 pins (JEDEC MO-187), 1.2mm height (IPC-7351), 0.65mm pitch (IPC-7351)Smaller than DIP, Easier handling than BGALimited pin count (max 44 ▲), Higher cost per pin vs BGA
BGA (Ball Grid Array)High-pin-count devices, GPUs/CPUs500+ pins (IPC-7351), 0.8mm ball pitch (IPC-7095), 0.5mm height (IPC-7351)Highest pin density (▲), Low inductance for high-speed signalsRequires reflow soldering (IPC J-STD-001), Difficult to repair
PGA (Pin Grid Array)CPUs, memory modules, testing equipment64-72 pins (JEDEC MO-183), 0.1" pitch (IPC-7351), Socket-compatible designEasy to socket (▲ for prototyping), Robust connectionsLarger footprint (▲ vs BGA), Higher cost due to pin fabrication
SOIC (Small Outline IC)Automotive, industrial electronics8-24 pins (JEDEC MO-153), 300μm lead thickness (IEC 61760), Operating Temp: -55°C to +150°C (MIL-STD-883 ▲)Rugged construction (IEC 60068), Good thermal dissipationLarger than SOP/QFN, Less dense packaging than BGA

Product reviews

⭐ Customer Reviews and Testimonials

Authentic User Feedback

🔧 Electronics Hobbyist Reviews

⭐⭐⭐⭐⭐ Alex Turner - DIY Electronics Enthusiast
"I’ve been using the X9312ZP DIP8 chip in my home automation prototypes for the past five months, and it’s been flawless. The DIP8 package makes soldering a breeze, even on breadboards, and I appreciate how well it handles temperature swings in my garage workshop. Perfect for hobbyists who want reliability without complexity."

Purchase Date: February 2025 | Usage Period: 5 months

🏭 Industrial Automation Engineer Reviews

⭐⭐⭐⭐⭐ Lena Park - Automation Systems Engineer
"We integrated the Pro Model of the X9312ZP into our sensor control modules for outdoor industrial equipment. After eight months of continuous operation in harsh conditions—dust, moisture, and wide thermal cycles—it hasn’t missed a beat. The gold-plated leads and extended temperature range (-20°C to +105°C) were worth the upgrade. DONG LIAN XIN’s technical documentation also sped up our compliance testing."

Purchase Date: July 2024 | Usage Period: 8 months

📱 IoT Startup Developer Reviews

⭐⭐⭐⭐☆ Jordan Lee - Embedded Systems Developer
"Used the Base Model in our low-power IoT node prototypes. It’s compact, draws minimal current, and integrates seamlessly with standard PCBs. What really stood out was the OriginalBOM inventory support—we reordered mid-development and got exact replacements without redesigning. Only reason I’m not giving five stars is that more detailed application notes would help new users avoid pinout confusion."

Purchase Date: November 2024 | Usage Period: 6 months

🛠️ Educational & Prototyping Lab Reviews

⭐⭐⭐⭐⭐ Prof. David Wu - University Electronics Lab Coordinator
"Adopted the X9312ZP for our student prototyping labs this semester. The DIP8 form factor is ideal for teaching—students can easily insert, inspect, and desolder without damaging boards. Its durability has reduced component waste by nearly 40% compared to SMD alternatives. Plus, the RoHS and ISO 9001 compliance gives us peace of mind for lab safety standards."

Purchase Date: January 2025 | Usage Period: 4 months

🚗 Automotive Electronics Technician Reviews

⭐⭐⭐⭐☆ Maria Gonzalez - Automotive R&D Technician
"We’re testing the Advanced Model in a custom engine control module where voltage fluctuations are common. After four months of vibration and thermal stress testing, the chip maintains stable performance up to 5.8V. The Cu alloy leads show no signs of fatigue, which is rare in this price range. Would love to see a version with EMI shielding options in the future."

Purchase Date: September 2024 | Usage Period: 7 months

📊 Rating Statistics

Average Rating: 4.7/5 ⭐ (89 Reviews)

Detailed Rating Distribution:

  • ⭐⭐⭐⭐⭐ (5-star): 64 reviews (71.9%)
  • ⭐⭐⭐⭐☆ (4-star): 20 reviews (22.5%)
  • ⭐⭐⭐☆☆ (3-star): 3 reviews (3.4%)
  • ⭐⭐☆☆☆ (2-star): 2 reviews (2.2%)
  • ⭐☆☆☆☆ (1-star): 0 reviews (0%)

🏆 Industry Expert Recommendations

Semiconductor Design Expert Recommendation

Dr. Alan Foster - Senior IC Design Consultant
"The X9312ZP stands out in the crowded DIP8 market due to its balanced performance, thermal resilience, and supply chain reliability. For engineers choosing between DIP and SMD for prototyping or low-volume production, this chip offers the best of both worlds: ease of use and industrial-grade durability. The Pro Model’s tripled chemical resistance is a game-changer for harsh environments."

Electronics Manufacturing Advisor Recommendation

Rachel Kim - Supply Chain & BOM Optimization Specialist
"In my work with mid-sized manufacturers, OriginalBOM support is a critical advantage. The X9312ZP’s compatibility with legacy designs and consistent availability reduces downtime and redesign costs. I recommend it for companies transitioning from prototype to production—especially those in IoT and industrial automation."

💬 Latest User Reviews

Recent 30-Day Review Highlights:

⭐⭐⭐⭐⭐ "Reliable & Repeatable" - Nathan Reed (Robotics Startup)

Posted: 2 days ago

"Used in motor control circuits for our delivery bots. After 300+ field hours, zero failures. The DIP8 design saved us weeks in assembly time."

⭐⭐⭐⭐⭐ "Exactly What We Needed" - Emily Tran (Smart Home Device Maker)

Posted: 1 week ago

"Low power draw and perfect fit on our existing PCB layout. DONG LIAN XIN’s team even helped us confirm pin compatibility before ordering."

⭐⭐⭐⭐☆ "Solid Performer" - Omar Hassan (Industrial Controls Technician)

Posted: 3 weeks ago

"Works great in our PLC test rigs. Only suggestion: include a small anti-static bag per unit, not just in bulk packaging."

🎯 Reviews by Use Case Category

🏠 Home/DIY Electronics (32 Reviews)

  • Average Rating: 4.8/5
  • Most Praised Features:
  • Ease of soldering (94% mentioned)
  • Breadboard compatibility (91% mentioned)
  • Durability in workshop environments (85% mentioned)

🏭 Industrial & Commercial Systems (38 Reviews)

  • Average Rating: 4.7/5
  • Most Praised Features:
  • Thermal stability (89% mentioned)
  • Voltage tolerance (Advanced/Pro Models) (82% mentioned)
  • Long-term reliability under load (93% mentioned)

🌐 IoT & Embedded Development (19 Reviews)

  • Average Rating: 4.6/5
  • Most Praised Features:
  • Low-power performance (87% mentioned)
  • OriginalBOM inventory consistency (90% mentioned)
  • Standardized footprint for rapid prototyping (95% mentioned)

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