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  • XC511301VPV8 0K75F MCU chip for Audi and Porsche BCM
XC511301VPV8 0K75F MCU chip for Audi and Porsche BCM
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XC511301VPV8 0K75F MCU chip for Audi and Porsche BCM

  • 5 - 99 Pieces
    $25
  • >= 100 Pieces
    $24.50
View product details

XC511301VPV8 0K75F MCU chip for Audi and Porsche BCM

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Automotive Body Control Management: Designed for Body Control Module (BCM) applications in premium vehicles like Audi and Porsche, enabling centralized control of electrical systems (e.g., lighting, locks, and sensors).
  • Programmable FPGA Core: Functions as a Field-Programmable Gate Array (FPGA) chip, allowing real-time reconfiguration for digital signal processing, cryptography, and embedded system tasks.

Key features

  • 1. Advanced Material Technology

    • With gold-plated pins and a corrosion-resistant semiconductor coating, ensure reliable conductivity and durability in automotive environments*.

  • 2. Programmable FPGA Architecture

    • With multi-configurable FPGA design, customize digital signal processing for diverse automotive applications like body control modules (BCM) compared to fixed-function ICs*.

  • 3. High-Performance Processing

    • With high-speed FPGA processing, achieve up to 25% faster task optimization than conventional fixed-logic chips in automotive systems*.

  • 4. Automotive-Grade Reliability

    • With a robust 100-pin QFP package and automotive-grade materials, ensure seamless operation in harsh automotive environments (e.g., temperature fluctuations, vibration)*.

  • 5. Compliance with Industry Standards

    • With compliance to automotive electronics standards (e.g., ISO/TS 16949), meet stringent quality and safety requirements for vehicle control systems*.

Product details

XC511301VPV8 0K75F MCU chip for Audi and Porsche BCM

The XC511301VPV8 0K75F MCU chip is a high-performance FPGA designed for automotive Body Control Modules (BCM) in premium vehicles like Audi and Porsche. Its quad flat package (QFP) with 100 pins ensures robust connectivity and thermal efficiency, while gold-plated pins and a protective coating enhance reliability in harsh environments.

Technical specifications

FeatureSpecificationApplication Scenario
Package Type100-pin QFP (10x10 grid)Automotive BCMs requiring dense I/O and heat dissipation
Mounting TypeSurface Mount Technology (SMT)Automated assembly in automotive electronics manufacturing
MaterialSilicon semiconductor with gold-plated pinsEnsures conductivity and durability in corrosive conditions
FPGA Logic Density512K LE (Look-Up Tables)Supports complex digital signal processing for advanced BCM functions
Operating Temp.-40°C to +125°CReliable operation in extreme automotive environments

Customization guide

Adjustable parameters include I/O configuration (reprogrammable for specific BCM functions) and logic resource allocation (optimize for signal processing or encryption tasks).

Get inspired

With its FPGA flexibility, this chip enables custom solutions for automotive systems—whether enhancing infotainment interfaces, optimizing power distribution, or adapting to future software updates.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Logic Density512K LE+15% (589K LE)+30% (665K LE)*
I/O Count100 pins120 pins140 pins
Operating Voltage1.2V-3.3V1.0V-3.3V0.9V-3.3V
Temperature Range-40°C to +125°CSameSame

Supplier's note

  1. Three Technical Breakthroughs:

    • Reprogrammable FPGA Core: Enables real-time updates for BCM functions without hardware changes.
    • Gold-Plated Pins: 20% lower contact resistance than standard pins, ensuring stable connections in vibration-prone automotive environments.
    • Thermal Coating: Reduces heat buildup by 30% compared to uncoated chips, critical for BCM reliability.

  2. Version Selection Guide:

    • Base Model: Ideal for entry-level BCMs with standard functionality (e.g., basic lighting control).
    • Advanced Model: Best for mid-tier applications requiring enhanced I/O (e.g., climate control systems).
    • Pro Model: Recommended for premium vehicles like Audi/Porsche, where high logic density and low voltage support advanced driver-assistance systems (ADAS).

With the Pro Model’s 665K LE density, you can handle complex ADAS algorithms while maintaining low power consumption. Its 140-pin configuration ensures seamless integration with high-bandwidth automotive sensors.

Frequently asked questions

  • Which FPGA chip is best suited for Audi and Porsche BCM systems?

  • Is the XC511301VPV8 compatible with SMT mounting for automotive electronics?

  • Can the XC511301VPV8 be programmed for custom automotive BCM functions?

  • Is the XC511301VPV8 certified for automotive-grade reliability?

  • What materials ensure durability in high-temperature automotive environments?

  • How does the 100-pin QFP design benefit automotive BCM applications?

  • Can this chip handle real-time signal processing for vehicle systems?

  • What makes the XC511301VPV8 suitable for Audi/Porsche-specific BCM needs?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
FPGA Logic DensityAutomotive BCM systems, embedded control150K logic cells (Industry: 100K ▲50%)
Advanced: 200K logic cells (▲33% over Base)		Handles complex automotive protocols (e.g., LIN/CAN)
Supports multi-tasking		Higher power draw at peak loads (Base: 2.5W, Advanced: 3.2W)
I/O Pin CountSensor-rich systems100 I/O pins (Industry: 64 ▲56%)
Advanced: 144 pins (▲44% over Base)		Direct interface with 100+ sensors (ISO 16750-4 automotive compliance)Requires custom PCB layout for full utilization (Base: $500, Advanced: $800)
Mounting TypeSpace-constrained electronicsSMT (Surface-Mount Technology)40% smaller footprint vs through-hole (IEC 60793 standards)Requires reflow soldering equipment (Industry standard: wave soldering)
Operating TemperatureHarsh automotive environments-40°C to +125°C (Industry: -20°C to +85°C ▲56% range)Survives engine bay heat (AEC-Q100 Grade 2 certification)Thermal throttling at extremes (Advanced: 10% slower at +125°C)
ReprogrammabilityFirmware-updatable systemsField-reprogrammable via JTAG (Industry: fixed firmware)OTA updates for security patches (IEEE 1687 compliance)Requires secure bootloader (Adds $200 to BOM for encryption)
Power EfficiencyBattery-powered ECUs1.2V core voltage (Industry: 1.5V ▲20% savings)
Advanced: 0.9V (▲25% over Base)		30% lower idle power (Base: 0.5W, Advanced: 0.35W)Performance drops 15% under heavy load (Advanced: 3.2W vs Industry 4.0W)

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