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  • Xwitzeal Q1 Screen Control Phone CPU Grinding Machine for BGA Motherboard IC Chip PCB Board Polishing for Mobile Phone Repair
  • Xwitzeal Q1 Screen Control Phone CPU Grinding Machine for BGA Motherboard IC Chip PCB Board Polishing for Mobile Phone Repair
  • Xwitzeal Q1 Screen Control Phone CPU Grinding Machine for BGA Motherboard IC Chip PCB Board Polishing for Mobile Phone Repair
  • Xwitzeal Q1 Screen Control Phone CPU Grinding Machine for BGA Motherboard IC Chip PCB Board Polishing for Mobile Phone Repair
  • Xwitzeal Q1 Screen Control Phone CPU Grinding Machine for BGA Motherboard IC Chip PCB Board Polishing for Mobile Phone Repair
  • Xwitzeal Q1 Screen Control Phone CPU Grinding Machine for BGA Motherboard IC Chip PCB Board Polishing for Mobile Phone Repair
Xwitzeal Q1 Screen Control Phone CPU Grinding Machine for BGA Motherboard IC Chip PCB Board Polishing for Mobile Phone Repair

Xwitzeal Q1 Screen Control Phone CPU Grinding Machine for BGA Motherboard IC Chip PCB Board Polishing for Mobile Phone Repair

$490.00-$520.00/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized logo(Min.Order: 10000 pieces)
Customized packaging(Min.Order: 10000 pieces)
Graphic customization(Min.Order: 10000 pieces)

Xwitzeal Q1 Screen Control Phone CPU Grinding Machine for BGA Motherboard IC Chip PCB Board Polishing for Mobile Phone Repair

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Precision Grinding & Polishing: Designed for high-precision grinding and polishing of BGA motherboards, IC chips, and PCB boards, critical for mobile phone repair and electronics manufacturing.
  • Dual-Mode Operation: Equipped with both manual and automatic modes, enabling flexible control for detailed adjustments or streamlined workflows.

Key features

  • 1. Corrosion-Resistant Metal Construction

  • With a sturdy corrosion-resistant metal body, ensure long-lasting durability in workshop environments. This robust design is 20% more resistant to wear and tear compared to plastic-bodied models*, making it ideal for frequent use in repair shops.

  • 2. Dual-Mode Digital Control Panel

  • With a touchscreen interface offering manual and automatic operation modes, switch seamlessly between precise manual adjustments and automated workflows. This flexibility reduces setup time by up to 30% compared to single-mode machines*.

  • 3. Micron-Level Precision Grinding

  • With a precision worktable integrated with a magnifying glass, achieve micron-level accuracy in PCB polishing. This ensures 50% higher precision than standard handheld tools*, critical for delicate BGA and IC chip repairs.

  • 4. Tailored for Mobile Repair Efficiency

  • With presets optimized for BGA motherboard and PCB polishing, streamline repair processes for electronics technicians. Designed for quick turnaround, it cuts repair time by 25% compared to generic grinding tools*.

  • 5. Global Compatibility & Safety Standards

  • With dual-voltage compatibility (110V/220V), operate seamlessly worldwide without adapters. Safety features like an emergency stop button and vacuum system meet international industrial safety certifications*, ensuring reliable use in diverse settings.

Product details

Xwitzeal Q1 Screen Control Phone CPU Grinding Machine for BGA Motherboard IC Chip PCB Board Polishing for Mobile Phone Repair

The Xwitzeal Q1 Screen Control Phone CPU Grinding Machine is a precision-engineered tool designed for BGA motherboard, IC chip, and PCB board polishing in mobile phone repair. Built with a robust metal frame and modular components, it offers dual-voltage compatibility (110V/220V), manual/automatic operation modes, and advanced safety features.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialHigh-strength aluminum alloyWithstands heavy-duty use in repair workshops
Voltage Compatibility110V/220V adjustableGlobal usability without voltage conversion
Control PanelDual-mode (Manual/Automatic)Precision adjustments for delicate repairs
Vacuum System500W suction powerDust-free workspace during polishing
Precision InspectionMagnifying worktable + LED lightingMicro-level component alignment
Safety FeaturesEmergency stop button + thermal guardPrevents accidents during high-load operations

Customization guide

Adjustable worktable dimensions (up to 300x200mm) and vacuum suction intensity allow customization for specialized PCB sizes or dust-sensitive environments.

Get inspired

With the Xwitzeal Q1, repair technicians can achieve micron-level precision in polishing BGA chips, ensuring flawless rework on damaged motherboards. Its modular design adapts to both small-scale workshops and high-volume repair centers.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Precision Level±0.02mm±0.01mm±0.005mm*
Automation SupportManual-onlySemi-automatedFully automated
Max Load Capacity5kg8kg12kg
Dust ExtractionBasic vacuumHEPA filtrationIndustrial-grade

Supplier's note

  1. Technical Breakthroughs:

    • Dual-Voltage Compatibility: Enables global deployment without power conversion.
    • Precision Magnifying Worktable: Reduces alignment errors by 40% compared to manual tools.
    • Thermal Guard System: Prevents overheating, extending tool lifespan by 25%.
  2. Version Selection Guide:

    • Base Model: Ideal for small repair shops prioritizing cost-efficiency.
    • Advanced Model: Suitable for medium-scale operations needing semi-automated precision.
    • Pro Model: Recommended for industrial users requiring micron-level accuracy and heavy-duty performance.

The Pro Model’s ±0.005mm precision meets aerospace-grade standards, enabling flawless repairs on high-density PCBs. Pair its industrial vacuum with thermal guard technology to ensure zero-defect rework.

Frequently asked questions

  • Which Xwitzeal Q1 model suits small mobile phone repair shops for BGA PCB polishing?

  • How do I clean the vacuum system of the Xwitzeal Q1 grinding machine?

  • Metal vs plastic build: Why is the Xwitzeal Q1 made of metal for PCB repair?

  • Can the Xwitzeal Q1’s worktable be customized for specific PCB repair tasks?

  • Is the Xwitzeal Q1 voltage-compatible with global power standards?

  • Can I switch between manual and automatic modes on the Xwitzeal Q1?

  • What safety features does the Xwitzeal Q1 grinding machine include?

  • How precise is the Xwitzeal Q1 for mobile phone CPU PCB polishing?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Voltage CompatibilityGlobal repair shops, multi-region useDual voltage (110V/220V) ▲▲▲
(Industry: Single voltage)
Universal use without converters; reduces setup complexitySlightly heavier due to dual-transformer design
Precision AccuracyBGA chip polishing, PCB repair±0.01mm accuracy (ISO 230-2)
(Base: ±0.05mm; Industry: ±0.1mm)
Ensures micro-level precision for delicate componentsRequires skilled operators for optimal results
Operation ModesAutomated mass production, manual repairsDual modes (Manual/Automatic) ▲
(Industry: Manual-only)
Flexibility for both precise manual tasks and high-volume automated workflowsHigher cost due to dual-mode control systems
Dust CollectionCleanroom environments, electronics labs120 CFM vacuum system ▲▲
(Base: 80 CFM; Industry: 60 CFM)
Reduces contamination risks in sensitive manufacturing settingsRequires regular filter maintenance
Motor PowerHeavy-duty grinding, industrial use500W motor (ISO 13289 compliant) ▲
(Industry: 300W)
Handles thick PCB materials and durable componentsHigher energy consumption compared to basic models
Safety FeaturesHigh-risk manufacturing facilitiesEmergency stop button + overload protection ▲▲
(Industry: Basic E-stop)
Reduces accident risks in high-pressure workflowsAdds complexity to operation training

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