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  • YX T862 BGA Reballing Machine Infrared Bga Rework Station
YX T862 BGA Reballing Machine Infrared Bga Rework Station
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YX T862 BGA Reballing Machine Infrared Bga Rework Station

  • >= 1 Sets
    $250.00

Customization:

Customized logo（Min.Order: 10 pieces）
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YX T862 BGA Reballing Machine Infrared Bga Rework Station

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • BGA Reballing & Precision Soldering: Designed for high-precision BGA (Ball Grid Array) chip reballing and infrared rework, enabling accurate repair and modification of electronic components.
  • Integrated Microscope & Temperature Control: Features a high-definition adjustable microscope for precise work on micro-components and a digital temperature control system (05–100 range) for optimal soldering/desoldering.

Key features

  • 1. Corrosion-Resistant Metal Construction

    • With a robust stainless steel/aluminum alloy base, ensure long-term durability in high-temperature workshop environments. The metal body resists wear and thermal stress, outlasting plastic-based competitors*.

  • 2. Integrated High-Definition Microscope

    • With a built-in adjustable HD microscope, achieve precise component inspection and alignment for intricate BGA reballing tasks. Eliminate the need for external magnification tools, saving time and workspace*.

  • 3. Precision Temperature Control

    • With a digital touchscreen interface and real-time temperature display (05–100°C range), adjust heat settings for optimal soldering/desoldering performance. Achieve ±1°C accuracy, surpassing manual temperature control methods*.

  • 4. Versatile Scenario Adaptability

    • Designed for both lab-grade precision and field-repair resilience, the YX J-862 handles high-volume commercial tasks and delicate DIY projects. Its compact footprint suits professional and hobbyist workshops alike*.

  • 5. Compliance with Electronics Industry Standards

    • Built with materials and components meeting professional safety certifications (e.g., RoHS compliance*), ensuring reliability for critical electronics repair applications.

Product details

YX T862 BGA Reballing Machine Infrared Bga Rework Station

The YX T862 BGA Reballing Machine is a professional-grade infrared BGA rework station designed for precision electronic repair and soldering. Equipped with an electric-driven welding robot, it features a robust metal base, high-definition microscope, and adjustable temperature control, enabling seamless handling of delicate components.

Technical specifications

FeatureSpecificationBenefit
Temperature Control Range100°C to 500°C (digital display)Ensures precise thermal management for diverse materials.
Heating Plate MaterialStainless steel with grid patternEnhances heat distribution and component stability.
Microscope Magnification10x–50x adjustableEnables detailed inspection of micro-components.
Soldering Iron Flexibility360° rotating handleFacilitates ergonomic access to tight spaces.
CertificationCE, RoHS compliantMeets global safety and environmental standards.

Customization guide

Adjustable temperature ranges (±5°C precision) and heating plate dimensions (up to 150x150mm) can be customized to meet specific thermal requirements for high-volume production or delicate PCB repairs.

Get inspired

Whether you’re desoldering BGA chips, reballing components, or prototyping circuit boards, the YX T862’s integrated microscope and robotic precision empower professionals to tackle complex repairs with confidence.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Temperature Accuracy±10°C±5°C±2°C*
Microscope Magnification10x–30x10x–50x10x–100x
Heating Plate Size100x100mm120x120mm150x150mm
Cooling Rate20°C/sec25°C/sec30°C/sec*

Supplier's note

  1. Technical Breakthroughs:

    • Precision Temperature Control: The Pro Model’s ±2°C accuracy ensures minimal thermal stress on sensitive components.
    • High-Magnification Microscope: The 100x magnification in the Pro Model enables nano-level inspections, ideal for advanced semiconductor repairs.
    • Robotic Stability: The electric-driven welding robot reduces human error by 40% compared to manual tools.

  2. Optimal Version Selection:

    • Base Model: Suitable for small workshops handling routine PCB repairs (e.g., consumer electronics).
    • Advanced Model: Recommended for mid-tier manufacturers requiring 50x magnification and larger heating plates for industrial components.
    • Pro Model: Best for R&D labs or high-volume production lines needing ultra-precise BGA reballing (e.g., aerospace or medical device manufacturing).

With the Pro Model’s 30°C/sec cooling rate, you can cycle through rework tasks 20% faster than industry benchmarks. Pair its stainless steel heating plate with ±2°C accuracy to ensure flawless solder joints in temperature-sensitive applications.

Frequently asked questions

  • Which BGA reballing machine suits precision electronics repair tasks?

  • How do I maintain the heating plate of the YX T862 infrared rework station?

  • What materials make the YX T862 BGA rework station durable for professional use?

  • Can the YX T862 BGA machine be customized for specific repair workflows?

  • Is the YX T862 infrared BGA rework station certified for industrial use?

  • How does the integrated microscope enhance BGA rework precision?

  • What temperature range does the YX T862 BGA machine support?

  • Why choose the YX T862 over manual soldering tools for BGA repairs?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Temperature ControlPrecision soldering of heat-sensitive componentsIndustry Standard: Up to 450°C (ISO 9001)
Our Base: 480°C (IEC 60695)
Our Advanced: 500°C (UL 746C)		▲ Base: 30°C hotter than standard for complex BGA rework
▲▲ Advanced: Handles high-temperature alloys		Industry Standard: Risk of damage to delicate components
Microscope MagnificationInspecting microscopic solder jointsIndustry: 10x (ISO 10110)
Base: 20x (ISO 10110)
Advanced: 30x (ISO 10110)		▲ Base: Doubles clarity for fine details
▲▲ Advanced: 3× zoom for nano-level precision		Industry: Misses micro-defects in BGA balls
Material QualityHeavy-duty industrial useIndustry: Standard steel (ASTM A36)
Base: Stainless Steel (ASTM A276)
Advanced: Aerospace-grade aluminum (ASTM B211)		▲ Base: Corrosion-resistant for chemical labs
▲▲ Advanced: 40% lighter for ergonomic handling		Industry: Prone to rust in humid environments
Automation LevelHigh-volume production linesIndustry: Manual operation
Base: Semi-automated (preset programs)
Advanced: Fully robotic (ISO 9283)		▲ Base: 50% faster setup than manual
▲▲ Advanced: Zero human error in mass reballing		Industry: Labor-intensive and inconsistent results
Noise LevelOffice or shared workshop environmentsIndustry: 55 dB (OSHA limit)
Base: 48 dB (IEC 60704)
Advanced: 43 dB (IEC 60704)		▲ Base: Quieter than vacuum cleaner (55 dB)
▲▲ Advanced: Whisper-quiet (quieter than refrigerator hum)		Industry: Disruptive in open-plan labs
CustomizationCustom BGA rework projectsIndustry: Limited presets
Base: 10+ customizable profiles (IEC 61131)
Advanced: AI-driven adaptive settings (ISO 13399)		▲ Base: Tailors to 20+ component types
▲▲ Advanced: Self-optimizes for new PCB designs		Industry: Rigid, no adaptability for unique tasks

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