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Customization:
The Zhida Shunfa Original New IC Components KMQ820013M-B419 BGA series combines robust performance with compliance certifications for industrial applications. Designed for machine systems, these components feature high-density ball grid array (BGA) packaging and a protective black square component, ensuring reliable connectivity and environmental resilience.
| Feature | Specification | Benefit |
|---|---|---|
| Material | Solder alloy (tin-silver-copper) for BGA; conductive polymer/black metal for protective component | Ensures durable, corrosion-resistant connections and environmental protection |
| Certifications | EPR_Germany_Packing, EPR_France_Packing, RoHS | Meets EU environmental and safety standards for global compliance |
| Packaging Density | High-density BGA grid with 0.8mm pitch solder balls | Enables compact designs for space-constrained machine systems |
| Operating Range | -40°C to +125°C | Reliable performance in extreme industrial environments |
| Application | Industrial machinery, power electronics, high-performance computing | Optimized for demanding machine applications |
Adjustable parameters include:
Elevate your machine systems with components engineered for precision and durability. Whether you need high-current handling for power electronics or compact designs for embedded systems, the KMQ820013M series delivers tailored solutions.
| Parameter | Base Model | Advanced Model | Pro Model |
|---|---|---|---|
| Solder Ball Count | 256 | 384 (+50%) | 512 (+100%)* |
| Thermal Resistance | 0.15°C/W | 0.12°C/W (20% lower) | 0.09°C/W (40% lower) |
| Operating Temp Range | -40°C to +85°C | -40°C to +105°C | -40°C to +125°C |
| Certifications | RoHS | RoHS + EPR_Germany | RoHS + EPR_Germany/France |
Technical Breakthroughs:
Version Selection Guide:
With the Pro Model’s triple-certified packaging and superior thermal resistance, users can safely deploy components in harsh industrial settings while meeting stringent EU regulations. Pair its dense solder ball array with high-current capabilities to achieve seamless integration in demanding systems.
*Note: Comparative values reflect improvements over the Base Model.
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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.
