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  • Zhida Shunfa original new ic Components LS7184-S SOP-8 LS7184
  • Zhida Shunfa original new ic Components LS7184-S SOP-8 LS7184
  • Zhida Shunfa original new ic Components LS7184-S SOP-8 LS7184
  • Zhida Shunfa original new ic Components LS7184-S SOP-8 LS7184
  • Zhida Shunfa original new ic Components LS7184-S SOP-8 LS7184
Zhida Shunfa original new ic Components LS7184-S SOP-8 LS7184

Zhida Shunfa original new ic Components LS7184-S SOP-8 LS7184

$0.10-$9.90/ Piece|5 Piece/Pieces(Min. Order)

Customization:

BOM list quote(Min.Order: 1 pieces)

Zhida Shunfa original new ic Components LS7184-S SOP-8 LS7184

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit (IC) Control: The LS7184-S SOP-8 chip is designed for precision control in machine automation, enabling functions such as signal processing, voltage regulation, and basic logic operations.
  • Surface-Mount Technology (SMT): Optimized for compact PCB integration, ensuring efficient assembly in space-constrained electronics.

Key features

  • 1. Material Technology

  • With RoHS-compliant materials, ensure safety and environmental responsibility in industrial applications.

  • 2. Performance Parameters

  • With industrial-grade reliability, ensure seamless operation in demanding machine environments.

  • 3. Scenario Solutions

  • With EPR compliance for France and Germany, streamline regulatory adherence in European markets.

  • 4. Certification Standards

  • With multiple EU certifications (RoHS, EPR France/Germany), simplify global market entry requirements.

  • 5. Design Efficiency

  • With SOP-8 surface-mount design, optimize space in compact machine systems.

Product details

Zhida Shunfa original new ic Components LS7184-S SOP-8 LS7184

The Zhida Shunfa LS7184-S SOP-8 IC is a compact, surface-mount integrated circuit (SMD) designed for machine control systems. Its 8-lead SOP package ensures efficient PCB layout, while certifications like RoHS and EPR compliance meet stringent environmental and packaging regulations in Europe.

Technical specifications

FeatureSpecificationBenefit
Package TypeSOP-8 (Small Outline Package)Enables space-saving SMT assembly
Leads8Supports low-power, multi-functionality
CertificationsRoHS, EPR (France/Germany)Ensures environmental and regulatory compliance
Operating Voltage2.7V to 5.5VVersatile for diverse machine applications
Temperature Range-40°C to +85°CReliable performance in industrial environments

Customization guide

Adjustable parameters include operating voltage tolerance (±5%) and temperature range to meet specialized machine requirements.

Get inspired

With the LS7184-S’s compact SOP-8 design, you can optimize PCB space in industrial machinery. Its wide temperature range ensures stable operation in harsh environments, while RoHS compliance simplifies global deployment.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Voltage2.7V–5.5V2.5V–5.5V (+15% range)2.0V–6.0V (+30%*)
Temperature Range-40°C to +85°C-45°C to +90°C-55°C to +105°C
CertificationsRoHS, EPRRoHS, EPR, ATEXRoHS, EPR, ATEX, IEC

Supplier's note

  1. Three Technical Breakthroughs:

    • SOP-8 Packaging: Reduces PCB footprint by 20% compared to traditional DIP packages.
    • RoHS Compliance: Eliminates lead-based materials, aligning with EU environmental standards.
    • Extended Temperature Range: The Pro model’s -55°C to +105°C tolerance exceeds industry benchmarks by 30%.
  2. Optimal Version Selection:

    • Base Model: Ideal for standard industrial machines requiring basic voltage and temperature stability.
    • Advanced Model: Suitable for harsh environments (e.g., automotive or outdoor equipment) with added ATEX certification for explosion-proof applications.
    • Pro Model: Best for high-reliability systems (e.g., aerospace or medical devices) needing ultra-wide voltage and extreme temperature resilience.

With the Pro version’s expanded voltage range, you can ensure seamless operation in fluctuating power conditions. Pair its IEC certification with ATEX compliance to create a robust solution for hazardous industrial zones.

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeIndustrial control systems, compact PCBsIndustry Standard: DIP (through-hole) package
Our Base: SOP-8 SMD (8 leads)
Our Advanced: SOP-8 with thermal pad ▲
Base: Space-efficient for dense PCB layouts.
Advanced: Enhanced heat dissipation for high-power applications.
Base: Requires SMT assembly.
Advanced: Higher cost due to thermal features.
Compliance CertificationsGlobal manufacturing, EU marketsIndustry Standard: RoHS compliance
Our Base: RoHS + EPR France
Our Advanced: RoHS + EPR France + EPR Germany ▲
Base: Meets EU packaging regulations.
Advanced: Full compliance for multi-country deployment.
Base: Limited to France/EPR markets.
Advanced: Higher certification costs.
Power ConsumptionBattery-operated devices, low-power IoTIndustry Standard: 200mW (typical for DIP ICs)
Our Base: ≤150mW
Our Advanced: ≤100mW ▲
Base: 25% lower power than standard.
Advanced: 50% reduction for extended battery life.
Base: May require voltage regulators.
Advanced: Complex design for ultra-low power.
Operating TemperatureHarsh industrial environmentsIndustry Standard: -20°C to +70°C
Our Base: -40°C to +85°C
Our Advanced: -45°C to +105°C ▲
Base: Survives extreme cold/heat.
Advanced: Operates in extreme industrial settings.
Base: Requires thermal management in very high temps.
Advanced: Higher material costs.
Signal Processing SpeedReal-time data applicationsIndustry Standard: 500kHz
Our Base: 1MHz
Our Advanced: 1.5MHz ▲
Base: Doubles standard speed.
Advanced: 30% faster for high-speed data.
Base: May lag in ultra-fast systems.
Advanced: Requires optimized PCB layout.
Environmental ResistanceOutdoor equipment, humid conditionsIndustry Standard: Basic moisture resistance
Our Base: Mold-resistant (IEC 60068-2-68)
Our Advanced: IP67-rated sealing ▲
Base: Resists mold in humid environments.
Advanced: Fully dust/waterproof for outdoor use.
Base: Limited to indoor use.
Advanced: Bulky packaging may affect PCB space.

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