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  • Zhida Shunfa original new ic Components HI3536DRBCV100 BGA HI3536
  • Zhida Shunfa original new ic Components HI3536DRBCV100 BGA HI3536
  • Zhida Shunfa original new ic Components HI3536DRBCV100 BGA HI3536
  • Zhida Shunfa original new ic Components HI3536DRBCV100 BGA HI3536
  • Zhida Shunfa original new ic Components HI3536DRBCV100 BGA HI3536
Zhida Shunfa original new ic Components HI3536DRBCV100 BGA HI3536

Zhida Shunfa original new ic Components HI3536DRBCV100 BGA HI3536

$0.10-$9.90/ Piece|5 Piece/Pieces(Min. Order)

Customization:

BOM list quote（Min.Order: 1 pieces）
View product details

Zhida Shunfa original new ic Components HI3536DRBCV100 BGA HI3536

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Density Integration & Surface Mount Technology: Designed for compact, high-performance embedded systems, the HI3536DRBCV100 BGA IC leverages a ball grid array (BGA) configuration to enable space-saving integration in electronic devices.
  • Machine-Specific Application: Optimized for industrial and consumer machine applications, such as IoT devices, smart appliances, and automation systems, requiring reliable computing and connectivity.

Key features

  • 1. Material Technology

    • With a corrosion-resistant protective coating and conductive metal alloy base, ensure long-term durability in industrial environments. Complies with RoHS standards for environmental safety.

  • 2. Interactive Design

    • With a compact BGA (Ball Grid Array) configuration, enable seamless surface mount integration, simplifying assembly processes compared to traditional DIP packages*.

  • 3. Performance Parameters

    • With high-density integration technology, achieve multi-functional performance in compact designs, ideal for space-constrained machine applications like industrial automation or smart devices.

  • 4. Scenario Solutions

    • Designed for machine applications, ensure reliable operation in industrial or automated systems, enhancing efficiency in manufacturing and IoT-enabled environments.

  • 5. Certification Standards

    • Certified to RoHS, EPR (Germany/France), and other environmental regulations, ensuring compliance with global sustainability and packaging standards for seamless international deployment.

  • Notes:

    • Material Technology: Emphasizes corrosion resistance and environmental compliance (RoHS).

Product details

Zhida Shunfa original new ic Components HI3536DRBCV100 BGA HI3536

The Zhida Shunfa HI3536DRBCV100 BGA IC components are high-density integrated circuits designed for industrial and machine applications. Engineered with a robust BGA package and RoHS compliance, these components ensure reliability in harsh environments while meeting EU environmental standards (EPR Germany/France).

Technical specifications

FeatureSpecificationApplication Scenario
MaterialConductive metal alloy with black protective coatingIndustrial machinery requiring corrosion resistance and thermal stability
Size14mm × 14mm BGA package (208 pins)Compact devices needing high-density integration (e.g., robotics, IoT)
CertificationsRoHS, EPR_Germany_Packing, EPR_France_PackingCompliance for EU market entry and environmental regulations
Operating Temp-40°C to 85°CHarsh industrial environments (e.g., automotive, manufacturing)

Customization guide

Adjustable parameters include pin count (up to 208 pins), voltage compatibility (3.3V/5V), and thermal performance. Customize pin layouts to fit specific PCB designs or enhance thermal dissipation for high-power applications.

Get inspired

With the HI3536’s BGA design, you can achieve high-density integration in compact industrial devices. The rugged construction ensures reliability in robotics, automated manufacturing, and smart factory systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Pin Count144 pins168 pins208 pins
Thermal PerformanceStandard+15% enhanced+30% premium*
Operating Temp Range-40°C to 85°C-40°C to 85°C-40°C to 105°C

Supplier's note

  1. Technical Breakthroughs:

    • BGA Design: Enables 30% higher pin density than traditional QFN packages, ideal for space-constrained systems.
    • RoHS Compliance: Meets EU environmental standards without compromising performance.
    • Customizable Thermal Management: The Pro Model’s enhanced thermal performance allows operation in extreme environments.

  2. Version Selection Guide:

    • Base Model: Suitable for basic machine control (e.g., simple automation systems).
    • Advanced Model: Optimal for complex systems requiring expanded I/O (e.g., industrial robots).
    • Pro Model: Best for high-reliability applications like automotive testing equipment, where 30% higher thermal performance ensures stability under prolonged stress.

*Pro Model’s thermal performance exceeds industry benchmarks by 30%.

Frequently asked questions

  • Which IC component suits high-density machine applications like industrial automation?

  • What materials are used in the HI3536DRBCV100 BGA to ensure durability?

  • Does the HI3536 comply with RoHS and EPR regulations for European markets?

  • Can the HI3536 be customized for specific pin counts or voltage requirements?

  • How does the BGA design of the HI3536 improve machine performance?

  • Which industries use the HI3536 for machine automation systems?

  • What precautions are needed when soldering BGA components like the HI3536?

  • How does the protective coating on the HI3536 ensure longevity in harsh environments?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
High-Density BGA ICsIndustrial automation, servers400+ pins (BGA15x15), 15mm×15mm (ISO 9001 certified) ▲
(Advanced: 500+ pins)		▲ Higher integration than industry standard (300 pins), compact designRequires advanced soldering tools, bulkier PCB layout, higher cost
Low-Power Embedded ICsIoT devices, wearables<1W power (IEC 60068), 5mm×5mm packageUltra-low power consumption, ideal for battery-operated devicesLimited computational power, may require external cooling for complex tasks
Industrial-Grade ICsFactory equipment, roboticsOperating temp: -40°C to 85°C (MIL-STD-810), RoHS/EPR-compliantRugged durability, environmental compliance (RoHS, EPR Germany/France)Costlier than consumer-grade ICs, larger form factor
Consumer Electronics ICsSmartphones, tablets200 pins (BGA10x10), 10mm×10mmCost-effective, mass-manufacturing scalabilityLower thermal tolerance, incompatible with industrial-grade applications
Automotive ICsVehicle control systemsAEC-Q100 qualified, 125°C max tempHarsh-environment reliability, vibration/shock resistanceExpensive, lengthy certification cycles, limited customization
Medical-Grade ICsDiagnostic devices, imaging systemsISO 13485 certified, EMI suppression (IEC 60601)Regulatory compliance, minimal electromagnetic interferenceSpecialized manufacturing, limited scalability, high development costs

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