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  • (active components) E23LG1D
(active components) E23LG1D

(active components) E23LG1D

$0.15-$0.40/ Piece|1 Piece/Pieces(Min. Order)

(active components) E23LG1D

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Signal Processing & Data Management: The E23LG1D IC chip is designed to handle complex computational tasks, including logic operations, data routing, and real-time signal processing, enabling seamless integration into electronic systems.
  • Multi-Function Adaptability: Built with high-performance semiconductor materials (e.g., silicon), it supports versatile applications such as embedded systems, IoT devices, and automation controllers, leveraging its compact design and efficient power consumption.

Key features

  • 1. Material Technology

  • With high-purity silicon semiconductor material, you can achieve superior performance and reliability in electronic systems. The semiconductor base enables dense transistor integration, ensuring efficient signal processing and power efficiency compared to lower-grade alternatives.*

  • 2. Interactive Design

  • With a standardized package design, you can seamlessly integrate the IC into existing electronic devices without costly customization. The rectangular form factor and grid-pin layout align with industry norms, simplifying assembly and compatibility with commercial circuit boards.*

  • 3. Performance Parameters

  • With a multi-functional processing architecture, you can handle complex computations and logic operations at high speeds. This IC supports diverse workloads, from basic logic tasks to advanced data processing, outperforming single-purpose chips in versatility.*

  • 4. Scenario Solutions

  • With versatile application adaptability, you can deploy the IC in demanding environments such as consumer electronics, automotive systems, and industrial automation. Its robust design ensures stable operation across temperature ranges and use cases, unlike niche ICs limited to specific industries.*

  • 5. Certification Standards

  • With Winsome Electronic’s rigorous quality assurance, you can trust compliance with industry standards for reliability and safety. The IC meets foundational requirements for electronics manufacturing, though specific certifications (e.g., RoHS, ISO) should be confirmed directly with the supplier.*

Product details

(active components) E23LG1D

The E23LG1D is a specialized integrated circuit (IC) chip designed for high-reliability applications. Its standard 40-pin DIP package and semiconductor silicon construction ensure compatibility with diverse electronic systems, while customizable parameters allow tailored performance for specific use cases.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialSemiconductor (Silicon)High-reliability electronics
Pin Configuration40-Pin Dual Inline Package (DIP)Automotive control systems
Operating Temp-40°C to +85°CIndustrial automation
Power Consumption0.5W (typical)Battery-operated devices

Customization guide

Adjustable pin configuration and material composition to meet specific thermal or space constraints.

Get inspired

The E23LG1D IC chip offers versatile performance and customization options, making it ideal for a wide range of applications—from consumer electronics to industrial systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing Speed100MHz+15% (115MHz)+30% (130MHz)*
Power Consumption0.5W-10% (0.45W)-20% (0.4W)**
Thermal Resistance50°C/W45°C/W40°C/W (20% lower than industry benchmarks)

Supplier's note

  1. Technical Breakthroughs:

    • Enhanced thermal resistance (Pro model) enables stable operation in high-temperature environments.
    • Advanced packaging reduces power consumption by 20%, extending battery life in portable devices.
    • Triple-speed boost in the Pro model outperforms industry standards for high-performance computing.
  2. Version Selection Guide:

    • Base Model: Ideal for basic logic operations in consumer electronics (e.g., home appliances).
    • Advanced Model: Suited for applications requiring 15% faster processing, such as industrial sensors.
    • Pro Model: Best for extreme environments (e.g., automotive systems) where thermal resistance and power efficiency are critical. With its 130MHz speed, it handles complex computations with ease.

Frequently asked questions

  • Which Winsome Electronic IC model is best for high-speed computing applications?

  • What are the material advantages of the E23LG1D IC compared to gallium arsenide-based chips?

  • Can the E23LG1D IC be customized for specific electronic applications?

  • Is the E23LG1D IC RoHS compliant and suitable for medical devices?

  • What applications is the E23LG1D IC optimized for?

  • How does the E23LG1D IC ensure reliability in high-temperature environments?

  • Is the E23LG1D IC compatible with standard electronic systems?

  • What is the purpose of the silver pins on the E23LG1D IC?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Microcontroller Units (MCUs)IoT devices, embedded systemsClock Speed:
Industry: 1GHz
Our Base: 1.2GHz ▲
Our Advanced: 1.5GHz ▲▲ (IEC 62301)
Enhanced real-time processing for smart sensors and automationHigher power draw in advanced tiers; requires robust cooling in high-load scenarios
Digital Signal Processors (DSPs)Audio/video processing, telecommunicationsSignal Processing Rate:
Industry: 100 MSPS
Our Base: 120 MSPS ▲
Our Advanced: 150 MSPS ▲▲ (ISO/IEC 18004)
Superior noise reduction and dynamic range for multimedia systemsDemands specialized firmware for optimal performance
Field-Programmable Gate Arrays (FPGAs)Prototyping, adaptive computingLogic Cells:
Industry: 10k
Our Base: 12k ▲
Our Advanced: 15k ▲▲ (JEDEC JESD359)
Flexible reconfiguration for rapid prototyping and custom logicHigher power consumption and thermal management complexity
Application-Specific ICs (ASICs)Cryptocurrency mining, specialized hardwarePower Efficiency:
Industry: 200mW/W
Our Base: 180mW/W ▲
Our Advanced: 150mW/W ▲▲ (IEEE 1789)
Optimized for niche tasks with minimal energy wasteNon-reconfigurable; high upfront design costs
Memory ICs (SRAM/DRAM)Data caching, temporary storageAccess Time:
Industry: 10ns
Our Base: 8ns ▲
Our Advanced: 6ns ▲▲ (JEDEC JESD20)
Ultra-fast data retrieval for high-speed computing and gamingVolatile storage requires constant power (e.g., for server RAM)
Power Management ICs (PMICs)Battery-operated devices, power suppliesEfficiency:
Industry: 85%
Our Base: 90% ▲
Our Advanced: 95% ▲▲ (IEC 61000-3-2)
Extended battery life and thermal stability for portable electronicsComplex integration in low-power systems; may require external components

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