(active components) HSRM20256LM12

Name: (active components) HSRM20256LM12
Brand: Shenzhen Winsome Electronic Technology Co., Ltd.
SKU: 1132729731_1
Price: 0.10 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

High-Performance Data Processing and Control: Designed to execute complex operations such as signal amplification, data processing, and system control, integrating multiple functions on a single chip.
Grid Pin Array Connectivity: The rectangular IC chip features a grid of pins for seamless integration into circuits, enabling efficient connectivity with other electronic components.

Key features

1. Material Technology

With a silicon semiconductor material, ensure efficient electronic signal processing and optimal heat dissipation for stable performance under high-load conditions.

2. Interactive Design

With a grid array pin configuration, enable seamless integration into surface-mount technology (SMT) systems for easy assembly and space-saving design.

3. Performance Parameters

With multi-functional processing capabilities, achieve high-speed data computation and real-time task execution, ideal for complex electronic systems.

4. Scenario Solutions

With versatile application adaptability, support diverse use cases from consumer electronics (e.g., smartphones) to industrial automation and automotive systems.

5. Certification Standards

With compliance to industry-standard semiconductor manufacturing protocols, ensure reliability and safety across global electronics markets.

Product details

The HSRM20256LM12 is a high-performance integrated circuit (IC) chip designed for diverse electronic applications. Its compact QFN package, silicon semiconductor material, and wide operating temperature range make it ideal for space-constrained and demanding environments.

Technical specifications

Feature	Specification	Application Scenario
Material	High-purity monocrystalline silicon	Efficient heat dissipation in high-power systems
Size	14mm x 10mm	Space-saving design for wearables and IoT devices
Pin Configuration	48-pin QFN grid array	Seamless surface-mount assembly in complex PCBs
Operating Temp	-40°C to 125°C	Reliable operation in automotive/industrial settings
Power Consumption	≤0.5W	Prolonged battery life in portable electronics

Customization guide

Adjustable parameters include:

Pin Count: Customizable between 32–64 pins to match interface requirements.
Material: Options like gallium arsenide for high-frequency applications.
Temperature Range: Extended to -55°C for aerospace or extreme environments.

Get inspired

The HSRM20256LM12’s versatility enables innovation across industries. Whether optimizing battery life in smartwatches or ensuring reliability in industrial control systems, this IC chip delivers precision and efficiency.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Processing Speed	1GHz	+15% (1.15GHz)	+30% (1.3GHz)*
Power Efficiency	0.5W	20% lower	35% lower
Operating Temp Range	-40°C to 125°C	Same	-55°C to 150°C
Integration Complexity	Basic	Enhanced	Premium (full-system)

Supplier's note

Three Breakthroughs:
- Silicon Material: Enables 20% better thermal conductivity than traditional ICs, reducing overheating risks.
- QFN Pin Configuration: Supports 50% denser PCB layouts compared to TQFP packages.
- Pro Model’s Extended Temp Range: Operates reliably in -55°C environments, outperforming industry benchmarks by 30%.
Version Selection Guide:
- Base Model: Ideal for basic consumer electronics (e.g., smart home devices) requiring cost-effective performance.
- Advanced Model: Suited for mid-range applications like industrial sensors, offering 20% faster processing than competitors.
- Pro Model: Designed for aerospace and automotive systems where extreme temperatures and high-speed processing are critical.

With the Pro Model’s tripled chemical resistance rating, you can safely handle corrosive environments while its low-power design ensures minimal energy waste. Pair this with its extended temp range to create robust solutions for oil drilling or space exploration systems.

Frequently asked questions

Which IC chip model is best suited for compact electronic devices requiring high integration?
How does the silicon material in the HSRM20256LM12 IC chip enhance its functionality?
Can the HSRM20256LM12 IC chip be customized for specific electronic applications?
What certifications does the HSRM20256LM12 IC chip hold for industrial use?
How does the grid-array pin design improve circuit assembly efficiency?
What applications are ideal for the HSRM20256LM12 IC chip’s multi-function capabilities?
Is the HSRM20256LM12 suitable for high-frequency circuit designs?
How should the HSRM20256LM12 be stored to prevent static damage?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Power Efficiency	Battery-operated devices	Industry: 1W	Base: 0.75W (▲)	Advanced: 0.5W (▲▲) (IEC 62301 compliant)
Thermal Performance	High-temperature industrial machinery	Industry: 85°C max	Base: 95°C (▲)	Advanced: 105°C (▲▲) (JEDEC JESD51-2)
Signal Integrity	High-speed data transmission systems	Industry: 20MHz	Base: 30MHz (▲)	Advanced: 50MHz (▲▲) (ISO/IEC 11801)
Package Size	Compact wearable electronics	Industry: 10×10mm	Base: 8×8mm (▲)	Advanced: 6×6mm (▲▲) (IPC-7351)
Operating Temp Range	Outdoor industrial equipment	Industry: -20°C to 70°C	Base: -30°C to 85°C (▲)	Advanced: -40°C to 105°C (▲▲) (MIL-STD-810)
Customization Flexibility	Custom embedded systems	Industry: Limited	Base: Moderate (▲)	Advanced: Full (▲▲) (ISO/TS 16949)