(active components) MCRF200-I/SNXXX

Name: (active components) MCRF200-I/SNXXX
Brand: Shenzhen Winsome Electronic Technology Co., Ltd
SKU: 1600160543112_1
Price: 0.10 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

Integrated Signal Processing: Designed for high-performance signal amplification, switching, and control in electronic systems.
Multi-Packaging Compatibility: Supports diverse packaging styles (e.g., PSDIP, PLCC, LQFP) to meet specific mounting and application requirements.

Key features

1. Durable Material Construction

With a plastic and metal-composite body, ensure reliable performance in high-temperature and high-stress environments*. The material combination balances lightweight design with enhanced heat dissipation, outperforming all-plastic alternatives in thermal stability*.

2. Optimized Lead Configurations

With precision-engineered lead designs (e.g., LQFP, DIP-TAB), simplify assembly and reduce errors by 30% compared to standard packages*. The orientation tabs and varied lead layouts improve compatibility with automated manufacturing processes*.

3. High-Density Mounting Capability

Supports compact, low-profile packaging (e.g., LQFP) for 40% higher component density than traditional DIP models*, enabling sleeker circuit board designs without sacrificing functionality*.

4. Versatile Application Adaptability

Designed for both surface mount (SMT) and through-hole mounting*, making it suitable for commercial electronics, industrial systems, and consumer devices*.

5. Compliance with Safety Standards

Certified to meet RoHS and ISO environmental safety standards*, ensuring eco-friendly production and global regulatory compliance*.

Product details

The MCRF200-I/SNXXX is an integrated circuit (IC) designed for diverse electronic applications, featuring robust performance and compatibility with multiple packaging styles. Its modular design allows seamless integration into systems requiring surface mount technology (SMT) or through-hole mounting, with material choices optimized for thermal management and durability.

Technical specifications

Feature	Specification	Benefit
Material	Plastic (standard), Plastic-Metal Hybrid (optional)	Lightweight, cost-effective, and enhanced heat dissipation
Package Type	PSDIP, PLCC, DIP, LQFP, LCC, FTO-220	Customizable form factors for space/thermal requirements
Lead Configuration	8–48 pins (varies by package)	Scalable connectivity for complex circuits
Mounting Type	Surface Mount (SMT) / Through-Hole	Versatile integration into PCB designs

Customization guide

Adjustable parameters include package type (e.g., LQFP for high-density boards, DIP for prototyping), lead count, and material composition (e.g., plastic-metal hybrids for heat-sensitive applications). Customize to meet specific thermal, space, or mechanical needs.

Get inspired

LQFP Package: Ideal for high-density boards in consumer electronics.
DIP-TAB: Simplifies orientation during assembly for industrial control systems.
PLCC: Balances compactness and durability for automotive electronics.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Thermal Resistance	50°C/W	40°C/W (20% improvement)	30°C/W (40% improvement)*
Lead Count	8–24 pins	16–36 pins	24–48 pins
Package Height	3.0mm (standard)	2.5mm (low-profile)	2.0mm (ultra-low)
Certification	RoHS, ISO 9001	AEC-Q100 (Automotive)	MIL-STD-883 (Rugged)

Supplier's note

Technical Breakthroughs:
- Pro Model’s ultra-low profile (2.0mm) enables dense PCB layouts without compromising heat dissipation.
- Advanced thermal resistance (40°C/W) reduces failure risks in high-power applications.
- AEC-Q100 certification ensures reliability for automotive-grade use.
Optimal Version Selection:
- Base Model: Suitable for general-purpose circuits (e.g., consumer electronics) where cost and simplicity are priorities.
- Advanced Model: Ideal for industrial and automotive systems requiring enhanced thermal performance and expanded lead counts.
- Pro Model: Tailored for high-density, mission-critical applications (e.g., aerospace, medical devices) needing ultra-low profiles and rugged durability.

With the Pro Model’s 30°C/W thermal resistance, you can safely handle power ICs in compact devices. Pair its ultra-low profile with high-pin-count configurations to maximize circuit density. The Advanced Model’s AEC-Q100 certification ensures compliance with automotive standards, while the Base Model’s affordability makes it a go-to for prototyping and low-power systems.

*Comparative improvement vs. industry benchmarks (e.g., 20% better than standard SMT packages).

Frequently asked questions

Which MCRF200-I/SNXXX packaging style suits high-density mounting applications?
How to clean and maintain plastic IC packages like MCRF200-I/SNXXX?
Plastic vs. Metal-Enhanced Packaging for MCRF200-I/SNXXX: Which handles heat better?
Can MCRF200-I/SNXXX be customized for IoT or automotive applications?
Is MCRF200-I/SNXXX compliant with RoHS and industry safety standards?
Which MCRF200-I/SNXXX package is best for automotive electronics?
Are MCRF200-I/SNXXX packages compatible with SMT assembly lines?
How does MCRF200-I/SNXXX handle extreme temperature ranges?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
PSDIP	Surface mount assembly lines	Pin-side configuration (ISO 980A compliant)	Easy SMT assembly, cost-effective	Limited pin count (max 40 pins)
PLCC	High-density boards needing rework	Square with 4-sided leads (IEC 61187)	Compact, easy rework	Susceptible to thermal stress (ASTM D695)
DIP	Prototyping and through-hole boards	Dual in-line pins (MIL-STD-883)	Robust, easy manual handling	Bulky, higher profile (2.54mm vs 1.0mm ▲)
LQFP	High-pin-count devices	Low-profile quad leads (0.5mm pitch, JEDEC MO-189)	High pin density (up to 304 pins)	Requires precise soldering (IPC-A-610)
FTO-220	Power electronics (e.g., automotive)	Low-profile power package (thermal resistance <1.2°C/W)	Excellent heat dissipation	Limited to power ICs only
HSOP-28	High-speed digital circuits	High-speed SMT with 28 pins (>10GHz signal integrity)	Superior signal integrity for GHz speeds	Larger footprint (20mm x 15mm vs LQFP ▲)