(active components) NE646B

Name: (active components) NE646B
Brand: Shenzhen Winsome Electronic Technology Co., Ltd
SKU: 60226277266_1
Price: 0.52 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

High-Current Switching & Amplification: The NE646B is a Darlington transistor array IC designed for high-current applications, enabling precise signal amplification and switching in electronic circuits.
Versatile Output Configuration: Supports multiple output configurations (e.g., open-collector outputs) for driving LEDs, motors, or interfacing with microcontrollers.

Key features

1. Material Technology

With corrosion-resistant plastic encapsulation, ensure reliable operation in high-stress environments.

2. Interactive Design

With standardized surface-mount (SOT-23/SOT523) pin configurations, simplify integration into compact circuit boards.

3. Performance Parameters

With high-current handling capability (up to 500mA), outperform standard transistors in power-dense applications.

4. Scenario Solutions

With ruggedized design for both consumer and industrial use, balance cost-efficiency and durability.

5. Certification Standards

With RoHS and ISO 9001 certifications, meet global safety and quality benchmarks.

Product details

The NE646B is a versatile integrated circuit (IC) designed for transistor-based applications, offering compact form factors and robust performance across diverse electronic systems. Its modular design supports customization to meet specific power, thermal, or spatial requirements, making it ideal for consumer electronics, industrial control systems, and automotive applications.

Technical specifications

Feature	Specification	Application Scenario
Package Type	SOT-23/SOT523/SOT89	Space-constrained circuits (e.g., IoT devices)
Max Current	200mA–500mA (varies by package)	Low-to-medium power signal switching
Operating Temp	-40°C to +85°C	Industrial environments with thermal stress
Lead Configuration	3–8 pins (SOT variants)	Customizable pinouts for mixed-signal designs

Customization guide

Adjustable pin configuration and package size (e.g., SOT-23 for compactness, SOT89 for higher current) enable tailored solutions for applications requiring specific thermal, power, or spatial constraints.

Get inspired

With the NE646B’s modular design, engineers can optimize transistor performance for applications ranging from wearable devices to automotive control units. For instance, its SOT-523 package balances power handling and miniaturization, ideal for high-density PCB layouts.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Max Current	200mA	+30% (260mA)	+60% (320mA)*
Thermal Resistance	150°C/W	Improved (120°C/W)	Premium (85°C/W)
Voltage Rating	30V	40V	60V
Package	SOT-23	SOT-523	SOT-89/TO-263

Supplier's note

Three Technical Breakthroughs:
- The Pro Model’s 60V voltage rating exceeds industry standards by 100%, enabling safe operation in high-stress power circuits.
- Advanced Model’s 120°C/W thermal resistance ensures stable performance in compact IoT devices.
- Base Model’s SOT-23 package reduces PCB footprint by 40% compared to legacy DIP packages.
Optimal Version Selection:
- Base Model: Ideal for low-power consumer electronics (e.g., remote controls) where cost and space are prioritized.
- Advanced Model: Suited for industrial sensors or automotive ECUs requiring moderate power handling and thermal resilience.
- Pro Model: Best for high-power applications (e.g., power supplies, motor drivers) needing extreme voltage and thermal stability.

With the Pro Model’s 60V rating, you can safely handle industrial-grade power fluctuations. Pair its TO-263 package with heat sinks to maximize thermal efficiency, ensuring reliable operation in harsh environments.

Frequently asked questions

Which NE646B package suits small electronics projects with limited space?
How do I clean and maintain SOT-23/SOT523 packages on PCBs?
What’s the difference between SOT-23 and SOT89 packages for transistor output ICs?
Can the NE646B be customized for specific circuit configurations?
Is the NE646B’s material compliant with RoHS and REACH standards?
What’s the maximum voltage rating for the TO263/TO268 package in NE646B?
How do I ensure reliable soldering of SOT23/SOT323 packages?
Does the NE646B support high-temperature industrial environments?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
SOT-23	Small signal transistors, consumer electronics	3 leads, 2.9×1.6×1.0mm (JEDEC MO-119), 0.2A max current (per datasheet)	▲ Compact size for SMT; ideal for space-constrained devices	Limited power handling (e.g., unsuitable for motor drives)
SOT523	Low-power analog circuits, IoT devices	5 leads, 2.9×1.6×1.0mm, 0.5A max current (IEC 60747-15)	▲ 2.5× current capacity vs SOT-23; supports more complex circuits	Marginally larger than SOT-23
SOT89	Automotive sensors, medium-power ICs	8 leads, 4.9×3.9×1.3mm, 1.5A max current (per IPC-7351)	▲ 3× current capacity vs SOT523; robust for harsh environments	Bulky compared to SOT packages
TO263/TO268	Power supplies, motor control	8 leads, 1.5°C/W thermal resistance (IEC 60747-15), 10A max current	▲ 6.7× power handling vs SOT89; superior heat dissipation	Bulkier and costlier than SOT packages
SIP (Small Integrated Package)	Compact PCBs needing multiple ICs	10 ICs/cm² density (IPC-7351), 0.5mm lead pitch	▲ 50% space savings vs discrete ICs; simplifies layout	Complex repair/replacement; limited thermal performance
ZIP (Zigzag Integrated Package)	High-power thermal-sensitive apps	Zigzag layout, 0.8°C/W thermal resistance (IEC 60747-15)	▲ 44% better heat dissipation vs SIP; ideal for GPUs/processors	Requires specialized PCB design; higher cost