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The BGA Rework Station HR560 is a high-precision industrial tool designed for efficient BGA component rework and repair. With 3 independent temperature zones, laser alignment, and a robust metal/plastic construction, it ensures accuracy and durability in electronics manufacturing. The low-cost design and included reballing kit make it an ideal solution for PCB repair tasks requiring thermal control and precision.
| Feature | Specification | Benefit |
|---|---|---|
| Temperature Zones | 3 independent zones | Achieve precise thermal control for complex PCB rework |
| Laser Alignment | High-precision laser guidance | Reduce manual error and improve component placement accuracy |
| Voltage | 220V | Compatible with standard power outlets |
| Material Construction | Metal (gray) + Plastic (blue) | Durable yet lightweight design |
| Adjustable Arms | Multi-axis adjustable | Flexible handling of varying component sizes |
| Digital Control Panel | Programmable touchscreen interface | Automate tasks and monitor operations in real-time |
| Max Operating Temp | Up to 450°C | Handle high-temperature processes like soldering |
| Included Reballing Kit | Complete repair toolset | Streamline workflows with all-in-one solution |
Adjustable arms and temperature zones can be customized to meet specific rework needs, such as varying PCB sizes or component types. The programmable control panel allows users to tailor parameters for unique applications.
Whether repairing delicate electronics or assembling precision components, the HR560’s versatility and accuracy ensure reliable performance. Its laser alignment and multi-zone heating make it a go-to tool for high-volume production or intricate repair tasks.
| Parameter | Base Model | Advanced Model (HR560) | Pro Model |
|---|---|---|---|
| Temperature Zones | 2 | 3 (+50% zones) | 4 (+100% zones) |
| Max Operating Temp | 400°C | 450°C (+12.5% hotter) | 500°C (+25% hotter) |
| Laser Precision | ±0.2mm | ±0.1mm (+50% finer) | ±0.05mm (+100% finer) |
| Energy Efficiency | 1200W | 1000W (16.7% lower power) | 850W (29% lower power) |
| Reballing Kit Included | No | Yes | Yes + advanced tools |
Technical Breakthroughs:
Optimal Version Selection:
With the HR560’s 3 temperature zones, you can rework complex multi-layer PCBs with minimal thermal damage. Its laser alignment ensures precision even for 0.5mm pitch BGA chips. Compared to traditional systems, the Pro Model’s 500°C capacity enables safe handling of advanced materials like high-temperature polymers, creating a 40% faster workflow when paired with its low-power design.
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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.
