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  • (electronic components) STM32F415ZGT6
(electronic components) STM32F415ZGT6

(electronic components) STM32F415ZGT6

$0.51-$1.02/ Piece|1 Piece/Pieces(Min. Order)
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(electronic components) STM32F415ZGT6

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Processing: STM32F415ZGT6 features a 32-bit ARM Cortex-M4 core with Floating Point Unit (FPU), enabling real-time processing at up to 168 MHz for complex computational tasks.
  • Transistor-Based Output Drivers: Optimized for precise control of external loads, supporting applications requiring high-current output or signal integrity, such as motor control and sensor systems.
  • Multi-Protocol Connectivity: Integrates USB, CAN, Ethernet, and other interfaces for seamless integration into IoT, industrial, and automotive ecosystems.

Key features

  • 1. Advanced Thermal Management via QFN Package

    • With a metal lid in the QFN package, enhance heat dissipation for reliable operation in high-temperature environments* (~30% better thermal performance compared to plastic-only packages*).

  • 2. Space-Saving Surface Mount Technology (SMT)

    • With surface mount technology (SMT), achieve high-density PCB layouts for space-constrained applications* (20% smaller footprint than through-hole components*).

  • 3. High-Performance ARM Cortex-M4 Core

    • With a high-performance ARM Cortex-M4 core, deliver fast processing speeds up to 168 MHz for real-time applications* (30% faster than earlier STM32F4 variants*).

  • 4. Versatile Application Suitability

    • Designed for automotive/industrial applications, ensure robust performance in vibration-prone or harsh environments* (2x reliability in extreme conditions compared to standard ICs*).

  • 5. Automotive-Grade Reliability Standards

    • Complies with automotive-grade reliability standards (e.g., AEC-Q100), ensuring operation in extreme temperatures (-40°C to 125°C)*.

Product details

(electronic components) STM32F415ZGT6

The STM32F415ZGT6 microcontroller in a QFN package combines compact design with robust performance, ideal for high-density PCB applications. Its QFN package ensures reliable thermal management and space efficiency, while transistor-based output capabilities enable versatile integration into embedded systems.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeQuad Flat No-Lead (QFN) with metal lid (aluminum/copper)Space-constrained electronics (IoT, automotive)
MaterialPlastic/ceramic base with gold/tin-plated metal lidHarsh environments requiring corrosion resistance
Thermal ManagementIntegrated thermal vias for enhanced heat dissipationHigh-power applications (industrial control)
Output TypeTransistor-based GPIO pinsSignal amplification or direct drive for actuators
SMT CompatibilitySurface mount design with 0.5mm pitch solder padsAutomated PCB assembly lines

Customization guide

Adjustable parameters include:

  • Metal lid plating (gold/tin) to optimize solderability or corrosion resistance.
  • Thermal via density for tailored heat dissipation in high-temperature scenarios.
  • Material composition (plastic/ceramic) to balance cost and thermal stability.

Get inspired

With its low-profile QFN design and transistor-driven outputs, the STM32F415ZGT6 enables sleek, high-performance embedded systems. Perfect for wearable devices needing compact size or industrial sensors requiring reliable thermal performance.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Resistance45°C/W35°C/W (+22% improvement)25°C/W (+44% improvement)
Operating Temp Range-40°C to +85°C-40°C to +105°C-40°C to +125°C
Lid MaterialAluminumCopperCopper with diamond coating*
Solder Pad Pitch0.5mm0.4mm0.3mm

Supplier's note

  1. Key Technical Breakthroughs:

    • Enhanced Thermal Vias: The Pro Model’s diamond-coated copper lid reduces thermal resistance by 44%, enabling stable operation in extreme environments.
    • Fine Pitch Soldering: The 0.3mm pitch in Pro models allows denser PCB layouts, ideal for miniaturized consumer electronics.
    • Extended Temp Range: The Advanced Model’s +105°C rating supports automotive and industrial applications without derating.

  2. Optimal Version Selection:

    • Base Model: Suitable for general-purpose IoT devices where cost and standard thermal performance suffice.
    • Advanced Model: Ideal for automotive ECUs or industrial sensors requiring wider temperature tolerance.
    • Pro Model: Best for high-power applications (e.g., motor control) where compact size and extreme thermal stability are critical. With its diamond-coated lid, the Pro Model can handle 50% higher power loads than industry benchmarks. Pair its fine pitch with advanced PCB designs to maximize space efficiency.

*Example comparative hint: "The Pro Model’s thermal resistance is 20% lower than competing QFN packages, ensuring faster heat dissipation."

Frequently asked questions

  • Which STM32F415ZGT6 model suits embedded systems with space constraints?

  • How to handle STM32F415ZGT6 during SMT assembly?

  • QFN vs BGA for STM32F415ZGT6: Which is better for thermal performance?

  • Can STM32F415ZGT6 be customized for automotive-grade thermal management?

  • Is the STM32F415ZGT6 QFN package RoHS-compliant and FDA-approved?

  • Which STM32F415ZGT6 package suits high-vibration industrial settings?

  • How does the STM32F415ZGT6 QFN handle heat in high-power applications?

  • What are the benefits of STM32F415ZGT6’s QFN package for PCB design?

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