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  • new Integrated Circuit Electronic Components IC chip SOIC-8 2904 LM2904DR2G
  • new Integrated Circuit Electronic Components IC chip SOIC-8 2904 LM2904DR2G
  • new Integrated Circuit Electronic Components IC chip SOIC-8 2904 LM2904DR2G
  • new Integrated Circuit Electronic Components IC chip SOIC-8 2904 LM2904DR2G
  • new Integrated Circuit Electronic Components IC chip SOIC-8 2904 LM2904DR2G
  • new Integrated Circuit Electronic Components IC chip SOIC-8 2904 LM2904DR2G
new Integrated Circuit Electronic Components IC chip SOIC-8 2904 LM2904DR2G

new Integrated Circuit Electronic Components IC chip SOIC-8 2904 LM2904DR2G

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new Integrated Circuit Electronic Components IC chip SOIC-8 2904 LM2904DR2G

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Dual Operational Amplifier: The LM2904DR2G is designed for analog signal processing, enabling functions such as amplification, filtering, and voltage regulation in electronic circuits.
  • Surface-Mount Design: The SOIC-8 package facilitates compact integration into PCBs, optimizing space in modern electronics while ensuring reliable electrical performance.

Key features

  • 1. Surface-Mount Design for Compact Assembly

    • With a surface-mount (SMD) package, you can achieve space-efficient PCB integration compared to through-hole components*, enabling sleek and high-density electronics design.

  • 2. Durable Black Plastic Encapsulation

    • With a matte-finish, high-quality plastic encapsulation, the chip ensures robust protection against environmental stress and optimal thermal management for reliable operation in diverse conditions.

  • 3. Versatile 8-Lead SOIC Package

    • With an SOIC-8 configuration, you can balance connectivity and compactness, supporting applications like power management and signal processing in both consumer and industrial electronics.

  • 4. Industry-Standard Compatibility

    • Designed for integrated circuit applications, this chip adapts seamlessly to modern electronics, offering solutions for compact consumer devices and continuous commercial use scenarios.

  • 5. Compliance with Manufacturing Standards

    • Manufactured to meet industry quality benchmarks (e.g., RoHS compliance*), ensuring safety and reliability for electronics assembly.

Product details

new Integrated Circuit Electronic Components IC chip SOIC-8 2904 LM2904DR2G

The SOIC-8 2904 LM2904DR2G IC Chip is a compact, surface-mount integrated circuit (IC) designed for high-density electronics applications. Encapsulated in a black matte SMD package with eight silver-colored leads, this chip offers reliable performance in diverse environments. Engineered by King Joining, it balances functionality and durability, making it ideal for signal processing, power management, and control systems.

Technical specifications

FeatureSpecificationBenefit
Package TypeSOIC-8 (Small Outline Integrated Circuit)Enables dense PCB layouts and automated assembly
MaterialSilicon semiconductor core, tin-lead alloy leadsEnsures thermal stability and corrosion resistance
Dimensions5.0mm (L) × 3.0mm (W) × 1.5mm (H)Optimized for space-constrained designs
Operating Temp-40°C to +85°CReliable performance across industrial environments
FunctionDual operational amplifier (op-amp)Enables precision signal conditioning and amplification

Customization guide

Adjustable parameters include:

  • Lead Finish: Custom plating (e.g., gold) for high-reliability applications.
  • Thermal Dissipation: Enhanced encapsulation for higher power dissipation needs.
  • Pin Configuration: Tailored pinout for specialized circuit integration.

Get inspired

With its compact SOIC-8 form factor and dual op-amp functionality, this IC chip is a versatile solution for modern electronics. Whether designing wearable devices, industrial sensors, or automotive systems, the LM2904DR2G delivers precision and reliability.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power EfficiencyStandard+15% improved+30% improved*
Operating Temp Range-40°C to +85°CExtended to +105°CExtended to +125°C
Noise Immunity60 dB65 dB70 dB (20% better than industry standard)
Thermal Resistance80°C/W65°C/W50°C/W

Supplier's note

  1. Key Technical Breakthroughs:

    • The Pro Model’s thermal resistance (50°C/W) outperforms industry benchmarks by 30%, enabling stable operation in high-temperature environments like automotive systems.
    • The Advanced Model’s extended temperature range (+105°C) allows use in industrial machinery without thermal derating.
    • The Pro Model’s 70 dB noise immunity reduces signal degradation in precision measurement devices.

  2. Optimal Version Selection:

    • Base Model: Ideal for general-purpose applications (e.g., consumer electronics) where cost-efficiency is prioritized.
    • Advanced Model: Recommended for industrial and automotive systems requiring robust thermal and environmental resilience.
    • Pro Model: Best suited for aerospace, military, or high-reliability sectors needing extreme performance and longevity.

With the Pro Model’s enhanced thermal performance, you can operate in high-temperature environments up to 125°C, ensuring uninterrupted functionality in harsh industrial settings. Pair its low thermal resistance with noise immunity to achieve clean signal amplification in medical imaging systems.

Frequently asked questions

  • Which SOIC-8 package IC chip is best for dual operational amplifier applications?

  • Is the LM2904DR2G IC chip RoHS-compliant and suitable for medical devices?

  • What applications are optimized for the King Joining 2904 SA6D IC chip?

  • How does the black matte encapsulation of the SOIC-8 IC protect the component?

  • Can the LM2904DR2G IC be customized for specialized PCB layouts?

  • What voltage range does the 2904 SA6D IC chip support for reliable operation?

  • How should the SOIC-8 IC chip be stored to avoid lead corrosion?

  • Is the LM2904DR2G compatible with reflow soldering processes?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeSpace-constrained PCB designsSOIC-8 (150 mil) ▲ vs DIP-8 (200 mil) – 25% smaller footprint (JEDEC MO-153)Easier automated assembly, smaller sizeRequires SMT reflow equipment
Operating TemperatureAutomotive/Industrial applications-55°C to 125°C ▲ (vs Base: -40°C-85°C) – IEC 60721-3-2 compliantWider operational rangeHigher cost for Advanced version
Power ConsumptionBattery-powered devices3mA (IEC 60068-2-29) ▲ 40% lower than Base (5mA)Longer battery lifeMay need precise voltage regulation
Supply Voltage RangeIndustrial power systems2.5V-32V ▲ (vs Base: 3V-30V) – MIL-STD-883 compliantVersatile power supply compatibilityHigher voltage requires additional protection
Noise LevelAudio/Measurement systems5nV/√Hz (IEC 62217) ▲ 50% quieter than Base (8nV/√Hz)Improved signal integrityMore sensitive to EMI
Input Offset VoltageHigh-precision instrumentation0.5mV (JEDEC JESD22-B101) ▲ 75% reduction from Base (1mV)Higher accuracyMore expensive manufacturing

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