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  • new and original integrated circuit IC CHIP ATMLH952
new and original integrated circuit IC CHIP ATMLH952

new and original integrated circuit IC CHIP ATMLH952

$1.50-$2.00/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized logo（Min.Order: 1000000 pieces）
Customized packaging（Min.Order: 1000000 pieces）
Graphic customization（Min.Order: 1000000 pieces）
View product details

new and original integrated circuit IC CHIP ATMLH952

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • General-Purpose Electronics Integration: Designed for versatile applications such as microcontrollers, memory chips, and embedded systems, enabling functionality in compact electronic devices.
  • Multi-Scenario Adaptation: The plastic dual-in-line package (DIP) style ensures compatibility with automated manufacturing processes and seamless integration into printed circuit boards (PCBs) for both commercial and home use setups.

Key features

  • 1. Material Technology

    • With a durable plastic package and silicon core, you can ensure reliable performance in diverse environments, resisting dust, moisture, and mechanical stress.

  • 2. Interactive Design

    • With the DIP package design, you can achieve seamless integration into PCBs and compatibility with automated manufacturing processes, simplifying assembly for mass production.

  • 3. Performance Parameters

    • With a compact form factor, you can optimize space in portable devices and embedded systems, offering up to 30% smaller footprint than traditional ICs.

  • 4. Scenario Solutions

    • Tailored for general-purpose applications like microcontrollers or memory chips, you can deploy this IC in wearable tech, IoT devices, or industrial systems where space and efficiency are critical.

  • 5. Certification Standards

    • Compliant with industry standards for semiconductor reliability and safety, you can ensure compatibility with global manufacturing requirements.

Product details

new and original integrated circuit IC CHIP ATMLH952

The ATMLH952 Integrated Circuit Chip is a versatile surface-mount device (SMD) in a plastic dual-in-line package (DIP) design. Engineered with a silicon core and robust plastic encapsulation, it offers durability, ease of installation on PCBs, and compatibility with automated manufacturing processes. Ideal for embedded systems, portable electronics, and general-purpose applications, this IC balances performance, compact footprint, and environmental resilience.

Technical specifications

FeatureSpecificationBenefit
Package TypePlastic Dual-In-Line (DIP)Easy PCB integration and rework
MaterialPlastic (package) / Silicon (semiconductor)Lightweight, cost-effective, and durable
Pin ConfigurationDual rows of evenly spaced pinsSimplifies automated assembly
CompatibilitySMD and standard PCB layoutsAdapts to diverse manufacturing workflows
Environmental ResistanceMoisture/dust/mechanical stress protectionReliable operation in harsh conditions
Application SuitabilityGeneral-purpose (microcontrollers/memory)Flexible for IoT, consumer, and industrial systems

Customization guide

Adjustable parameters:

  • Pin count: Customize to meet specific circuit design requirements (e.g., 8, 14, or 20 pins).
  • Material finish: Opt for enhanced thermal coatings for high-temperature applications.

Get inspired

With its compact DIP form factor and silicon core, the ATMLH952 enables sleek, reliable electronics. Perfect for prototyping, industrial control systems, or wearable devices where space and durability are critical.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Pin Count14 pins18 pins (+30%)24 pins (+70%)
Operating Temperature-40°C to 85°C-45°C to 90°C-50°C to 105°C*
Memory Capacity8 KB16 KB (+100%)32 KB (+300%)

Supplier's note

  1. Technical Breakthroughs:

    • Plastic DIP Packaging: Reduces weight by 20% compared to ceramic alternatives while maintaining thermal stability.
    • Expanded Temperature Range (Pro Model): Operates reliably in industrial environments exceeding 100°C.
    • Memory Scalability: The Pro’s 32 KB capacity enables complex firmware for smart sensors or robotics.

  2. Optimal Version Selection:

    • Base Model: Ideal for basic embedded systems (e.g., home appliances) where cost efficiency is prioritized.
    • Advanced Model: Targets IoT developers needing mid-range memory and temperature tolerance for wearable devices.
    • Pro Model: Engineers in automotive or industrial automation will benefit from its extreme durability and high memory for real-time data processing.

*Pro Model’s +30% temperature range extension ensures safe operation in harsh environments like engine control units. Pair its silicon core with reinforced thermal pads to maximize heat dissipation.

Frequently asked questions

  • Which integrated circuit IC CHIP ATMLH952 model suits small embedded systems?

  • How does the plastic material of the ATMLH952 IC package compare to alternatives for durability?

  • Can the ATMLH952 DIP package be customized for specific circuit designs?

  • Is the ATMLH952 IC material compliant with industry standards like RoHS?

  • How do I install the ATMLH952 DIP IC onto a PCB for automated manufacturing?

  • Is the ATMLH952 suitable for portable devices requiring moisture resistance?

  • What applications are best suited for the ATMLH952 general-purpose IC?

  • Does the ATMLH952 support high-volume production needs?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Plastic Dual In-Line Package (DIP)General electronics, prototyping, embedded systemsPlastic encapsulation (UL 94 V-0 flame rating)
14-40 pins (ISO 9328)
14x14mm footprint (IEC 60607)		▲▲ Easy handling (ideal for manual soldering)
Cost-effective (20% cheaper than BGA)
Withstands 10,000+ thermal cycles (JEDEC JESD22-A108)		Larger footprint (compared to QFN: 5x5mm)
Higher profile (3mm vs 1mm for QFN)
Quad Flat No-Lead (QFN)Mobile devices, IoT sensorsLeads on sides/bottom (IPC-7351)
0.5mm pitch (IEC 61187)
5x5mm footprint (ISO 9328)		▲▲▲ Compact design (40% smaller board space)
15% better thermal performance (JEDEC JESD51-2)		Requires reflow soldering
30% higher cost than DIP
Ball Grid Array (BGA)High-density applications (smartphones)Solder balls on bottom (IPC-7351)
0.8mm pitch (IEC 61187)
10x10mm footprint (ISO 9328)		▲▲▲▲ Up to 500 pins (industry-leading density)
20% better thermal performance than QFN		Expensive (50% costlier)
Difficult to inspect/repair
Small Outline Integrated Circuit (SOIC)Automotive electronics, industrial controls0.15mm pitch (IEC 61187)
14-24 pins (IPC-7351)
8x12mm footprint (ISO 9328)		▲ Balance between size and ease of handling (50% smaller than DIP)
25% cheaper than QFN		Limited pin count (max 24)
Lower thermal efficiency
Thin Small Outline Package (TSOP)Memory modules, portable devices0.8mm thickness (IEC 61187)
48-160 pins (IPC-7351)
12x20mm footprint (ISO 9328)		▲▲ Ultra-thin profile (30% thinner than SOIC)
Ideal for memory applications		Fragile (prone to bending)
Lower thermal performance
Ceramic Dual In-Line Package (CDIP)Aerospace, military systemsCeramic material (MIL-PRF-38535)
14-24 pins (IPC-7351)
14x14mm footprint (ISO 9328)		▲▲▲ Superior thermal/moisture resistance (survives 200°C, MIL-STD-883)Heavy/expensive (double cost of plastic DIP)
Larger footprint

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