original electronic components ic of color tv

Customization:

Customized logo（Min.Order: 1000 pieces）

Customized packaging（Min.Order: 1000 pieces）

Graphic customization（Min.Order: 1000 pieces）

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original electronic components ic of color tv

Name: original electronic components ic of color tv
Brand: Shenzhen Sunshine Sea Technology Co., Ltd.
SKU: 60330366536_1
Price: 0.10 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

Integrated Circuit for TVs: Designed to enhance the performance and reliability of color televisions.
Versatile Electronic Component: Suitable for use in various electronic devices, including computers and other integrated circuits.

Key features

1. Material Technology

With ceramic cases and leadless chip carriers, experience enhanced durability and heat resistance in electronic components.

2. Interactive Design

With a variety of package types like BGA and DIP, ensure easy integration and adaptability across different electronic designs.

3. Performance Parameters

With high-speed small outline packages, achieve optimal performance and reliability in your electronic assemblies.

4. Scenario Solutions

With multi-package options, seamlessly integrate these components into TVs and computers for both home and commercial applications.

5. Certification Standards

With 100% original components, maintain quality assurance and compliance with industry standards for electronic parts.

Product details

Explore our range of original electronic components ideal for color TVs, featuring the PA2030A and 25Q16BVS1G models. These components are 100% original, ensuring reliability and high performance in electronic applications.

Technical specifications

Feature	Specification	Benefit
Material	Various package types	Versatile installation options
Size	Multiple configurations	Adaptable to different designs
Application	Integrated circuit use	Ideal for TVs and computers
Certification	Standard compliance	Assurance of quality

Customization guide

Adjustable parameters include pin configuration and package style to meet specific design needs for different electronic applications.

Get inspired

With our diverse packaging types, you can create compact and efficient designs for your color TV projects, enhancing both functionality and aesthetics.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Material Quality	Standard Ceramic	Enhanced Plastic	Premium Metal
Performance	Baseline	+15% Efficiency	+30% Performance*
Durability	Standard	Improved	Superior

Supplier's note

Our Pro Model's ceramic case offers triple the industry standard in durability, enabling reliable performance in high-demand environments. When paired with its superior material quality, this creates an ideal solution for high-performance electronic needs. For everyday use, the Advanced Model offers enhanced efficiency suitable for a broad range of applications, providing a balance of performance and cost-effectiveness.

Frequently asked questions

Which IC model suits small electronics for color TVs?
How to maintain and care for electronic component ICs in color TVs?
What is the difference between FDIP and Flat Pack packages for electronic components?
Can I get custom packaging for electronic components like the 25Q16BVS1G?
Is the electronic component PA2030A FDA-approved for safety?
Which package type is better for high-speed applications in TVs, HSOP28 or LBGA 160L?
Are the electronic components for color TVs 100% original and verified?
How do Gull Wing Leads enhance the connection in electronic components?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
FDIP	Compact electronics	Flat top, pins on bottom	Easy to mount (simple pin alignment)	Limited pin count (restricts complexity)
Flat Pack	High-density boards	Flat, rectangular with bottom pins	Space-efficient (minimal height)	Heat dissipation challenges
Gull Wing Leads	Secure connections	Leads bent at 90 degrees	Strong mechanical connection	Difficult to rework (lead bending)
HSOP28	High-speed circuits	28 pins, small outline	High speed data transfer	Limited thermal management
LBGA 160L	Advanced computing devices	Leadless ball grid array with 160 pins	High pin density (compact design)	Complex assembly process
Ceramic Case	High-temperature settings	Ceramic material	Excellent thermal properties	Higher cost (ceramic materials)

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