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  • shenzhen pcba assembly manufacture multilayer pcb
  • shenzhen pcba assembly manufacture multilayer pcb
  • shenzhen pcba assembly manufacture multilayer pcb
  • shenzhen pcba assembly manufacture multilayer pcb
  • shenzhen pcba assembly manufacture multilayer pcb
  • shenzhen pcba assembly manufacture multilayer pcb
shenzhen pcba assembly manufacture multilayer pcb

shenzhen pcba assembly manufacture multilayer pcb

$0.20-$10.00/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized logo（Min.Order: 5 pieces）
Customized packaging（Min.Order: 5 pieces）
Graphic customization（Min.Order: 5 pieces）
View product details

shenzhen pcba assembly manufacture multilayer pcb

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Electronics Support: Designed with FR-4 material and a dense component layout, the PCB enables robust power regulation, signal processing, and complex circuit integration for demanding applications.
  • Modular Assembly Compatibility: Features through-hole and surface-mount components, connectors, and integrated circuits, allowing seamless integration into diverse electronic systems.

Key features

  • 1. Material Technology

    • With FR-4 epoxy substrate and protective solder mask, you can achieve superior thermal and mechanical stability in industrial applications compared to standard PCB materials*.

  • 2. Interactive Design

    • With a hybrid modular design combining through-hole and SMT components, you can customize and integrate the PCB into complex systems with ease*.

  • 3. Performance Parameters

    • With a robust power supply section featuring high-capacity capacitors and inductors, you can maintain stable voltage under heavy loads, outperforming basic PCB designs by up to 30%*.

  • 4. Scenario Solutions

    • Designed for high-performance scenarios like industrial automation and data centers, you can ensure uninterrupted operation in demanding environments*.

  • 5. Certification Standards

    • With RoHS and ISO 9001 compliance, you can meet strict regulatory requirements and ensure quality manufacturing standards*.

Product details

shenzhen pcba assembly manufacture multilayer pcb

The Shenzhen PCBA assembly multilayer PCB is a high-performance printed circuit board designed for complex electronic systems. Built with FR-4 material and featuring a symmetrical layout, it combines durability, thermal stability, and versatile component integration. Ideal for industrial control, data centers, or high-end consumer electronics, this PCB supports through-hole and SMT components, enabling modular customization for diverse applications.

Technical specifications

FeatureSpecificationBenefit
MaterialFR-4 epoxy laminateEnhanced mechanical strength and thermal stability
Layer Count4–16 layers (adjustable)Supports complex circuit designs
Thermal PerformanceOperating temp: -40°C to +150°CReliable operation in extreme environments
Component Density500–2000 components per boardHigh integration for compact systems
Design SymmetryBalanced layoutReduces electromagnetic interference (EMI)

Customization guide

Adjustable parameters include layer count, component placement density, and material thickness to meet specific requirements for thermal management, signal integrity, or mechanical stress.

Get inspired

With its modular design and high component density, this PCB is perfect for creating robust industrial controllers, high-speed data routers, or wearable electronics. Its symmetrical layout ensures minimal noise, making it ideal for precision applications like medical devices or aerospace systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Layer Count4 layers+50% (6 layers)+150% (12 layers)
Max Operating Temp105°C125°C150°C
Component Density500 components1,200 components2,000 components
CustomizationStandard layersAdjustable layersFull layer tuning

Supplier's note

  1. Three Technical Breakthroughs:

    • FR-4 Material: With superior thermal stability, it outperforms standard PCB materials by 30% in heat dissipation.
    • Symmetrical Layout: Reduces EMI by 40%, enabling reliable operation in noisy environments.
    • Modular Design: Allows 20% faster assembly compared to rigid PCBs by supporting component reconfiguration.

  2. Optimal Version Selection:

    • Base Model: Ideal for SMEs needing cost-effective solutions for simple circuits (e.g., basic IoT sensors).
    • Advanced Model: Suitable for mid-tier applications requiring moderate complexity (e.g., industrial sensors or consumer appliances).
    • Pro Model: Tailored for enterprise-level systems demanding high-density integration (e.g., AI servers or medical imaging devices). With its 150°C thermal tolerance, the Pro version ensures stable operation in extreme industrial settings. Pair it with high-frequency capacitors to achieve 50% faster signal processing.

Frequently asked questions

  • Which multilayer PCB model suits high-frequency industrial applications?

  • FR-4 vs Aluminum PCB: Which is better for heat-sensitive electronics?

  • Can this PCB be customized with IoT connectors and expansion modules?

  • Is this PCB assembly RoHS and UL certified for global compliance?

  • How to clean and store PCB assemblies to prevent corrosion?

  • Does this PCB support both through-hole and SMT components for mixed designs?

  • Why is the symmetrical layout beneficial for signal integrity?

  • Which industries use Shenzhen-made multilayer PCBs for high-performance needs?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material SpecificationsHigh-temperature industrial/aerospaceIndustry: FR-4 Tg 130°CBase: FR-4 Tg 140°C (▲)Advanced: FR-4 Tg 170°C (▲▲)
(Tg: Glass transition temperature)
Layer CountHigh-density servers/medical devicesIndustry: 4–6 layersBase: 8 layers (▲)Advanced: 12 layers (▲▲)
Signal IntegrityHigh-speed data/telecomIndustry: ±15% impedance toleranceBase: ±10% (▲)Advanced: ±5% (▲▲)
Thermal DissipationPower electronics/LED lightingIndustry: Passive coolingBase: Aluminum backing (▲)Advanced: Embedded heat sinks (▲▲)
Component DensityCompact IoT/smartphonesIndustry: 500 components/m²Base: 800 (▲)Advanced: 1200 (▲▲)
Environmental ResistanceMarine/outdoor equipmentIndustry: 96hrs moisture resistance (IPC-6012)Base: 120hrs (▲)Advanced: 168hrs (▲▲)

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.