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  • standard IC chip around size vibration activated sound module
  • standard IC chip around size vibration activated sound module
  • standard IC chip around size vibration activated sound module
  • standard IC chip around size vibration activated sound module
  • standard IC chip around size vibration activated sound module
  • standard IC chip around size vibration activated sound module
standard IC chip around size vibration activated sound module

standard IC chip around size vibration activated sound module

$0.60-$1.50/ Piece|3000 Piece/Pieces(Min. Order)

Customization:

Customized logo(Min.Order: 2000 pieces)
Customized packaging(Min.Order: 2000 pieces)
Sound OEM making(Min.Order: 1000 pieces)

standard IC chip around size vibration activated sound module

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Vibration-Activated Sound Diffusion: The module uses an IC chip to convert electrical signals into precise vibrations, dispersing sound waves uniformly through its perforated cylindrical design. This reduces echo and standing waves for clearer audio.
  • DC-Powered Efficiency: Operates on DC input for stable, low-energy performance, ensuring reliable functionality in diverse environments.

Key features

  • 1. Advanced Vibration-Activated Technology

  • With a precision-engineered vibration-activated core, convert electrical signals into sound waves with 90% efficiency*, ensuring crisp, distortion-free audio output. Ideal for acoustic diffusers, this technology enhances sound diffusion to reduce echo and improve clarity in studios or home theaters.

  • 2. DC Input for Seamless Integration

  • With a DC input interface, achieve plug-and-play compatibility with existing audio systems, eliminating the need for complex wiring. Designed for easy installation in acoustic setups, from compact home theaters to professional recording studios.

  • 3. Instant Response for Real-Time Performance

  • With vibration activation in under 0.1 seconds*, deliver zero-latency sound output—perfect for live recordings or dynamic audio applications. Outperforms traditional modules by reducing activation delay by ~30%.

  • 4. Optimized for Acoustic Diffusion Solutions

  • Designed specifically for acoustic diffusers, this module enhances sound field uniformity by up to 40%*, breaking up standing waves and minimizing echo. Ideal for improving audio quality in spaces like home theaters, studios, or conference rooms.

  • 5. Certified for Safety and Sustainability

  • With RoHS and CE certifications, ensure compliance with global safety and environmental standards. The compact IC chip design also reduces material waste, aligning with eco-friendly manufacturing practices.

Product details

standard IC chip around size vibration activated sound module

The standard IC chip around size vibration activated sound module is an advanced acoustic component designed to convert electrical signals into precise vibrations for high-fidelity sound reproduction. Its cylindrical design with a perforated center optimizes sound diffusion, while the DC-powered IC chip ensures energy efficiency and reliability. Ideal for audio systems requiring clear, distortion-free sound, this module is adaptable for home theaters, recording studios, or professional audio setups.

Technical specifications

FeatureSpecificationBenefit
MaterialHigh-density polymer compositeLightweight, durable, and vibration-resistant
Size50mm diameter × 120mm heightCompact, fits standard acoustic mounting systems
Input TypeDC 5-12VStable power supply for consistent performance
Frequency Range20Hz–20kHz ±3dBFull-spectrum audio reproduction
Power Consumption≤3W at max outputEnergy-efficient operation
Vibration MechanismPiezoelectric IC-driven actuatorPrecise control for minimal distortion

Customization guide

Adjustable parameters include:

  • Frequency tuning (±5% range) to match room acoustics.
  • Output intensity (3-tier presets) for different audio environments.
  • Material substitution (e.g., aluminum alloy for industrial-grade durability).

Get inspired

With its vibration-activated design, this sound module delivers crisp, immersive audio by dispersing sound waves evenly. Whether enhancing a home theater’s bass response or reducing echo in a studio, its modular build allows seamless integration into custom audio systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Frequency Range20Hz–20kHz15Hz–22kHz10Hz–24kHz
Power Consumption≤3W≤2.5W (20% lower)≤2W (33% lower)*
Max Output85dB SPL90dB SPL (+6%)95dB SPL (+12%)
CertificationsCE, FCCCE, FCC, RoHSCE, FCC, RoHS, IP54

Supplier's note

  1. Technical Breakthroughs:

    • The Pro model’s expanded 10Hz–24kHz frequency range enables sub-bass and high-frequency clarity unmatched by standard modules.
    • All versions use piezoelectric IC actuators, reducing latency by 40% compared to electromagnetic designs.
    • The Advanced/Pro models feature dual-layer polymer composites, enhancing vibration efficiency by 25% in high-temperature environments.
  2. Optimal Version Selection:

    • Base Model: Ideal for home audio systems prioritizing cost-effectiveness. Its 85dB SPL suffices for small rooms.
    • Advanced Model: Best for studios or live venues needing 90dB SPL and RoHS compliance for EU projects.
    • Pro Model: Engineers handling industrial or outdoor audio setups will benefit from its IP54 rating and 95dB SPL for large spaces. With triple the bass response of competitors, it excels in theaters requiring deep sub-bass.

Frequently asked questions

  • Which vibration-activated sound module suits small home theaters or studios?

  • How to clean and maintain a vibration-activated sound module?

  • Plastic vs. Metal Enclosures: Which is better for vibration sound modules?

  • Can I customize the DC input voltage for my sound module?

  • Is the material of the sound module RoHS/CE certified?

  • Is this vibration sound module suitable for recording studios?

  • How does this module differ from traditional speakers?

  • What makes the IC chip in this sound module unique?

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