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1872 products found for

dc magnetron sputtering

4.24 hours on line or phone or by email technical support. 5.We offer detailed machine manual and software manual. Welcome to visit our factory, learn machine face to face.

Dual-Head Glass Magnetron Plasma Sputtering system/ rf dc magnetron sputter system glass magnetron sputtering system Brief introduction of rf dc magnetron sputter system VTC-600-2HD is a compact magnetron sputtering system with dual 2" target sources, e.g. vacuum level Heavy duty dual stage mechanical pump is connected to turbo pump for faster pump speed Mobile pump station is included and the compact sputtering coater can be put on top of station Max. Even though 5N purity Ar, usually contain 10- 100 ppm oxygen and H2O Structure of rf dc magnetron sputter system Source power of rf dc magnetron sputter system Vacuum pump station of rf dc magnetron sputter system Other types of rf dc magnetron sputter system

• Compact plasma sputtering coater designed for metallic coatings, such as gold, platinum, and silver. Input gas • One 1/4 Swagelok type tube fitting is installed for connecting the inert gas cylinder. Please consider our high power DC/RF magnetron sputtering coater or thermal evaporation coater.

3. Many units can be parallel operated to enlarge current, and it has automatic current sharing function. 7. Output constant voltage value and constant current value can be continuously adjusted within the range of respective maximum value (0-100%). O utput over - voltage, over - current and short-circuit protection Start-up with delay and soft start .

The magnetron sputtering target adopts the static electromagnetic field, which is curvilinear, while the plane target and cylindrical target adopt the uniform electric field and logarithm electric field respectively. Under effect of the electric field, the electron will collide with the argon atom in the process of accelerating flying to the substrate. The predetermined thickness of film can be reliably coated, and the sputtering coating film can be obtained with uniform thickness film layer on the large surface; 2) Strong adhesion of the film and the substrate.

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