AliChip IC New and Original HT46R23 chip IC CHIP IN STOCK

Key features

1. Advanced Material Technology for Enhanced Durability

With a ceramic-reinforced black plastic body, achieve superior thermal conductivity and mechanical durability compared to conventional plastic packages*. The material combination ensures reliable performance in high-stress environments, such as industrial electronics or automotive systems.

2. Space-Efficient QFN Package Design

With a compact quad flat no-lead (QFN) package, optimize space utilization in high-density PCB layouts, reducing board size by up to 30% compared to traditional leaded packages*. The 24-pin 4x6 grid configuration enables dense integration without sacrificing signal integrity.

3. High-Performance Thermal Management

With an integrated ceramic base and Pb-free solder joints, maintain optimal operating temperatures in high-power applications, outperforming standard plastic packages by up to 25% in thermal dissipation*. Ideal for continuous operation in IoT devices or embedded systems.

4. Multi-Function Pin Configuration for Versatility

With a programmable 24-pin layout supporting multi-functional connectivity, adapt to diverse system requirements such as sensor interfaces, microcontroller units (MCUs), or communication protocols*. The design reduces the need for additional components compared to less flexible ICs.

5. Compliance with Global Environmental Standards

With Pb-free solder compliant with RoHS and REACH regulations, ensure safe global deployment while minimizing environmental impact*. The lead-free alloy aligns with eco-friendly manufacturing trends, surpassing legacy models.