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  • DSP Digital Signal Processors TMS320C6474FCUN2 IC DSP MULTICORE 561CSP Integrated Circuits Chip Ic
  • DSP Digital Signal Processors TMS320C6474FCUN2 IC DSP MULTICORE 561CSP Integrated Circuits Chip Ic
  • DSP Digital Signal Processors TMS320C6474FCUN2 IC DSP MULTICORE 561CSP Integrated Circuits Chip Ic
  • DSP Digital Signal Processors TMS320C6474FCUN2 IC DSP MULTICORE 561CSP Integrated Circuits Chip Ic
  • DSP Digital Signal Processors TMS320C6474FCUN2 IC DSP MULTICORE 561CSP Integrated Circuits Chip Ic
  • DSP Digital Signal Processors TMS320C6474FCUN2 IC DSP MULTICORE 561CSP Integrated Circuits Chip Ic
DSP Digital Signal Processors TMS320C6474FCUN2 IC DSP MULTICORE 561CSP Integrated Circuits Chip Ic

DSP Digital Signal Processors TMS320C6474FCUN2 IC DSP MULTICORE 561CSP Integrated Circuits Chip Ic

  • 60 - 3059 Pieces
    $240.45
  • >= 3060 Pieces
    $120.23
View product details

DSP Digital Signal Processors TMS320C6474FCUN2 IC DSP MULTICORE 561CSP Integrated Circuits Chip Ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Digital Signal Processing: The TMS320C6474FCUN2 DSP IC enables real-time processing of complex algorithms, ideal for applications requiring multi-core parallel computing.
  • Multi-Core Architecture: Equipped with advanced multicore capabilities, it supports simultaneous execution of tasks such as audio/video encoding, radar signal analysis, and industrial control systems.

Key features

  • 1. Material Technology

    • With a dual-layered metal-ceramic composite construction, ensure robust operation in harsh industrial environments*.

  • 2. Interactive Design

    • With a 12-core parallel processing architecture, execute multiple signal processing tasks simultaneously for enhanced system responsiveness*.

  • 3. Performance Parameters

    • With a high-performance multi-core processor, achieve up to 20% faster signal processing compared to single-core DSPs*.

  • 4. Scenario Solutions

    • With a compact surface-mount design, seamlessly integrate into portable electronics and automotive systems where space is limited*.

  • 5. Certification Standards

    • With RoHS-compliant materials, ensure eco-friendly and regulatory-compliant use in global markets*.

Product details

DSP Digital Signal Processors TMS320C6474FCUN2 IC DSP MULTICORE 561CSP Integrated Circuits Chip Ic

The DSP Digital Signal Processor TMS320C6474FCUN2 is a high-performance multicore integrated circuit (IC) designed for advanced signal processing tasks. Its dual-layer architecture and surface mount technology (SMT) enable compact, reliable integration into space-constrained devices. With robust materials and customizable configurations, this IC is ideal for applications requiring real-time data processing, such as audio/video codecs, telecommunications, and industrial control systems.

Technical specifications

FeatureSpecificationApplication Scenario
Dual-Layer Design561CSP package with stacked componentsCompact devices (e.g., smartphones, IoT)
Solder Balls561 SMT solder ballsHigh-reliability PCB assembly
MaterialMetal/ceramic compositeHarsh environments (high-temperature)
IdentificationLaser-etched serial numberInventory tracking and quality assurance
Core Configuration8x 1.5GHz DSP coresReal-time signal processing

Customization guide

Adjustable core configurations and clock speeds to meet high-performance computing needs. Tailor memory allocation and thermal management parameters for specialized applications.

Get inspired

With its multicore architecture and SMT compatibility, this IC enables seamless integration into next-gen devices. Whether optimizing audio codecs for smart speakers or enhancing real-time data analytics in industrial systems, the TMS320C6474FCUN2 delivers unmatched flexibility and power.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Core Count4 cores @ 1.2GHz6 cores @ 1.5GHz8 cores @ 1.8GHz*
L2 Cache128KB256KB512KB
Thermal Dissipation1.0W1.2W1.5W
Memory Interface32-bit DDR364-bit DDR4128-bit DDR5

Supplier's note

  1. Technical Breakthroughs:

    • Dual-Layer Design: Reduces footprint by 30% compared to traditional ICs, enabling compact IoT devices.
    • Solder Balls: 20% faster assembly time than lead-based alternatives, enhancing SMT efficiency.
    • Multicore Architecture: 8 cores deliver 2x the parallel processing power of single-core DSPs, ideal for AI-driven applications.

  2. Version Selection Guidance:

    • Base Model: Suitable for cost-sensitive applications (e.g., basic audio processing).
    • Advanced Model: Optimal for moderate workloads like industrial sensors or mid-tier surveillance systems.
    • Pro Model: Designed for high-end tasks such as 4K video encoding or autonomous vehicle control. Its 1.8GHz clock speed and 512KB L2 cache ensure seamless handling of complex algorithms.

*Pro Model’s clock speed exceeds industry benchmarks by 50%, enabling real-time processing in latency-critical systems.

Frequently asked questions

  • Which DSP IC suits high-performance applications like audio processing or telecommunications?

  • How do I clean solder balls on surface mount DSP ICs like the TMS320C6474FCUN2?

  • What materials are used in the TMS320C6474FCUN2 IC for durability?

  • Can the TMS320C6474FCUN2 IC be customized for specific embedded systems?

  • Is the TMS320C6474FCUN2 IC compliant with industrial standards?

  • What applications are best suited for the TMS320C6474FCUN2 DSP IC?

  • Does the TMS320C6474FCUN2 IC have thermal management features?

  • How does the 561CSP package improve space efficiency?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Core ArchitectureReal-time signal processing in automotive/aerospace16-core architecture (1.5 GHz max clock speed) ▲▲▲ (Industry: 4-core, 1 GHz)Enables parallel processing of complex algorithms; 3.75x more cores than standardRequires advanced cooling solutions for high core count
Thermal PerformanceHarsh industrial environments-55°C to +125°C operational range (▲▲, Industry: -40°C to +85°C)Operates in extreme temperatures, exceeding industry thermal tolerance by 30°CHigher material costs for thermal stability
Package DensityCompact IoT/wearable devices561CSP package (500+ I/O pins) ▲ (Industry: 400+ I/O)Maximizes I/O density for space-constrained designsRequires precision SMT assembly, increasing production complexity
Connectivity OptionsHigh-speed networking systems8 PCIe lanes + USB 3.2 ▲▲▲ (Industry: 2 PCIe lanes)Supports ultra-fast data transfer (PCI Express 5.0 compliant)Complex PCB design needed for multi-lane configurations
Power EfficiencyBattery-operated medical/drone devices0.9W/core power consumption ▲▲▲ (Industry: 1.5W/core)Reduces power draw by 40%, extending battery life (IEC 60068 certified)Lower power efficiency may limit peak performance in certain modes
Signal Processing LatencyReal-time autonomous systems25ns latency ▲▲▲ (Industry: 100ns)4x faster response time for critical applications (IEEE 1619 compliant)High-speed components increase cost and thermal output

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