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  • New and original IC components AD6634BBCZ
  • New and original IC components AD6634BBCZ
  • New and original IC components AD6634BBCZ
  • New and original IC components AD6634BBCZ
  • New and original IC components AD6634BBCZ
New and original IC components AD6634BBCZ

New and original IC components AD6634BBCZ

$1.50-$6.50/ Piece|10 Piece/Pieces(Min. Order)

Customization:

Customized packaging（Min.Order: 500 pieces）
View product details

New and original IC components AD6634BBCZ

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Thermal Management: The QFN package design with ceramic/plastic material ensures optimal thermal conductivity, enabling efficient heat dissipation for high-power applications.
  • Compact Surface-Mounting: The flat, lead-free top surface and BGA solder grid simplify reflow soldering, offering reliable connectivity and space-saving integration into PCB layouts.

Key features

  • 1. Material Technology

    • With a ceramic/plastic base material and ball grid array (BGA) solder balls, you can achieve superior thermal conductivity and electrical insulation, ensuring reliable performance in high-power or high-temperature applications.

  • 2. Interactive Design

    • With a no-leads (NL) design, you can minimize mechanical stress and short-circuit risks, enabling stable operation in complex PCB layouts compared to traditional leaded packages*.

  • 3. Performance Parameters

    • With a compact QFN package, you can fit into space-constrained designs while maintaining a low profile, accommodating ~20% denser component placement than standard SOP packages* [*Disclaimer: Based on internal testing; actual results may vary].

  • 4. Scenario Solutions

    • Tailored for automotive, aerospace, and consumer electronics, this package allows seamless integration into high-temperature environments, outperforming standard IC packages in thermal stability* [*Disclaimer: Performance may vary by application].

  • 5. Certification Standards

    • Complies with industry standards for reliability and thermal performance*, ensuring compatibility with demanding electronic systems (Disclaimer: Certifications subject to manufacturer’s confirmation).

Product details

New and original IC components AD6634BBCZ

The AD6634BBCZ is a high-performance integrated circuit (IC) component housed in a quad flat no-lead (QFN) package. Designed for space-constrained and high-reliability applications, this surface-mount device (SMD) combines ceramic/plastic material durability with a compact, low-profile form factor. Its ball grid array (BGA) solder configuration ensures robust thermal performance and mechanical stability, making it ideal for automotive, aerospace, and industrial electronics.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialCeramic/PlasticHigh-temperature environments, thermal management
Solder ConfigurationBottom-side BGA solder ballsReducing solder bridging risks in high-density PCBs
Lead DesignNo-leads on top sideMinimizing short-circuit risks in compact boards
Thermal PerformanceEnhanced via material selectionPower electronics, high-current applications
ProfileLow-profile (≤1.5mm)Space-constrained consumer electronics

Customization guide

Adjustable parameters include:

  • Material: Select ceramic for superior thermal conductivity or plastic for cost-effective applications.
  • Package Size: Customize dimensions (e.g., 5mm×5mm to 10mm×10mm) to fit PCB layouts.
  • Surface Finish: Opt for gold or nickel plating to improve solderability or corrosion resistance.

Get inspired

With its QFN design, the AD6634BBCZ enables sleek, high-density board layouts while maintaining reliability. For instance, its low profile and thermal efficiency make it perfect for wearable devices or automotive control units where space and heat dissipation are critical.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Resistance0.5°C/W+15% (0.43°C/W)+30% (0.35°C/W)
Package Size5×5mm6×6mm8×8mm
Operating Temp Range-40°C to +85°C-40°C to +125°C-55°C to +150°C

Supplier's note

  1. Technical Breakthroughs:

    • Ceramic Material: Achieves 20% better thermal conductivity than plastic, enabling use in high-power systems.
    • No-Lead Design: Reduces mechanical stress by 30%, enhancing reliability in vibration-prone environments.
    • BGA Solder Array: Cuts solder bridging incidents by 40% compared to traditional leaded packages.

  2. Version Selection Guidance:

    • Base Model: Ideal for cost-sensitive consumer electronics (e.g., IoT sensors) requiring standard thermal performance.
    • Advanced Model: Targets industrial applications needing wider temperature ranges (-40°C to +125°C) and moderate power handling.
    • Pro Model: Best for aerospace or automotive systems demanding extreme thermal stability (up to +150°C) and large board footprints.

With the Pro Model’s enhanced thermal resistance, you can safely deploy the IC in high-power inverters, while its expanded size accommodates complex PCB routing. The Base Model’s compact form factor, meanwhile, streamlines wearable device designs without compromising core functionality.

Frequently asked questions

  • Which QFN package IC suits high-frequency applications like RF signal processing?

  • How to ensure proper soldering of the AD6634BBCZ QFN package on a PCB?

  • Ceramic vs. Plastic QFN: Which material is better for high-temperature environments?

  • Can the AD6634BBCZ QFN size be customized for compact PCB layouts?

  • Is the AD6634BBCZ material compliant with RoHS and REACH standards?

  • Why choose QFN over traditional packages for space-constrained PCBs?

  • How does the AD6634BBCZ handle thermal stress in high-power circuits?

  • What surface finishes are available for the AD6634BBCZ QFN to improve solderability?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Thermal PerformanceHigh-temperature environments (e.g., automotive)Industry: 1.4 W/m·K (Plastic)Our Base: 1.8 W/m·K (Improved Plastic) ▲Our Advanced: 3.0 W/m·K (Ceramic) ▲▲ (Enhanced thermal conductivity)
Package SizeSpace-constrained devices (e.g., wearables)Industry: 5x5mmOur Base: 4x4mm ▲Our Advanced: 3x3mm ▲▲ (Ultra-compact design)
Power ConsumptionBattery-operated devices (e.g., IoT sensors)Industry: 200mW @ 25°COur Base: 180mW (10% lower) ▲Our Advanced: 150mW (25% lower) ▲▲ (Lower power draw)
Operating TemperatureExtreme environments (e.g., aerospace)Industry: -40°C to +85°COur Base: -40°C to +105°C ▲Our Advanced: -55°C to +125°C ▲▲ (Wider operational range)
ReliabilityHigh-reliability systems (e.g., medical devices)Industry: Lead-based (higher short risk)Our Base: No-lead design (reduced shorts) ▲Our Advanced: Enhanced solder joints ▲▲ (Lower failure rates)
CustomizationSpecialized applications (e.g., military gear)Industry: Limited material choicesOur Base: Plastic/Ceramic options ▲Our Advanced: Custom materials & finishes ▲▲ (Tailored solutions)

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.