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One Stop OEM PCBA Fabrication Service OEM High Quality Multilayer PCB Assembly/PCB Manufacturer in China

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • PCB Fabrication & Assembly: High-quality multilayer PCBs made of durable FR-4 material, supporting complex electronic systems such as data processing, communication, and power management.
  • OEM Customization: Designed to integrate components like USB connectors, ICs, and power interfaces, enabling tailored solutions for networking, IoT, or industrial applications.

Key features

  • 1. Advanced Material Technology

  • With FR-4 epoxy-glass laminate material, ensure durable and reliable performance in complex electronic systems. This corrosion-resistant material outperforms basic alternatives in thermal and electrical stability, supporting long-term operational reliability.

  • 2. Customizable Interactive Design Solutions

  • With customizable design layouts, you can tailor the PCB to specific application needs, such as networking or communication systems. The modular design allows seamless integration of components like USB connectors and ICs, enabling rapid adaptation to evolving project requirements.

  • 3. High-Performance Multilayer Architecture

  • With multilayer architecture (2-16 layers), handle high-density circuitry for advanced applications like data processing and power management. This design minimizes signal interference and maximizes efficiency in compact spaces.

  • 4. Versatile Scenario Adaptability

  • With OEM customization capabilities, deploy in diverse scenarios—from industrial automation to consumer electronics. The board’s modular design ensures compatibility with both prototyping and mass production workflows.

  • 5. Stringent Certification Compliance

  • With EPR France Packing, EPR Germany Packing, and UL certifications, meet stringent safety and environmental standards for global markets. This ensures compliance with EU regulations and reduces barriers to market entry.

Product details

One Stop OEM PCBA Fabrication Service OEM High Quality Multilayer PCB Assembly/PCB Manufacturer in China

Our OEM PCBA fabrication service delivers high-quality multilayer PCB assemblies tailored for networking, communication, and power management applications. Built with FR-4 material and a green solder mask, the PCB features integrated circuits, USB/power connectors, and customizable component configurations. Certified to EPR France/Germany Packing and UL standards, it ensures compliance and reliability for global markets.

Technical specifications

FeatureSpecificationBenefit
MaterialFR-4 epoxy-glass laminateHigh thermal stability and durability
CertificationsEPR France Packing, UL, EPR GermanyCompliance with EU environmental/quality standards
CustomizationAdjustable component density/layer countFlexible adaptation to specific design needs
ConnectorsUSB, power connectors (TP17/TP19)Versatile interface compatibility
Solder MaskGreen epoxy resinEnhanced visibility and solder protection

Customization guide

Adjustable parameters such as layer count (4-16 layers), component density, and connector types can be tailored to meet requirements for high-speed data transmission, power efficiency, or compact form factors.

Get inspired

Design your next electronic system with confidence. Whether you need a compact IoT device, a rugged industrial controller, or a high-performance communication module, our customizable PCB assemblies provide the foundation to innovate.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Layer Count4 layers6 layers (+50%)8-16 layers (+200%)*
Material Thickness1.6mm1.6mm/2.0mm1.6mm-3.2mm (custom)
CertificationsUL, EPR France/Germany+RoHS, REACH+ISO 13485 (medical)
Max Component Density200/cm²300/cm² (+50%)500/cm² (+150%)

Supplier's note

  1. Technical Breakthroughs:

    • FR-4 Material: Enables thermal stability up to 140°C, ideal for industrial environments.
    • Multi-Certification Compliance: Simplifies global deployment with EPR France/Germany and UL certifications.
    • Modular Design: Adjustable layer counts and component placement allow rapid prototyping for IoT and 5G applications.
  2. Optimal Version Selection:

    • Base Model: Best for low-to-mid complexity projects (e.g., consumer electronics) requiring cost-effective solutions.
    • Advanced Model: Targets industrial IoT or automotive systems needing higher component density and 6-layer routing.
    • Pro Model: Ideal for high-end applications like medical devices or aerospace, with ultra-thick layers and ISO 13485 compliance.

With the Pro Model’s 16-layer capability, you can achieve signal integrity for GHz frequencies, while its 3.2mm thickness ensures mechanical robustness in ruggedized equipment. Pair this with RoHS compliance to meet EU regulations for eco-friendly manufacturing.

Frequently asked questions

  • Which multilayer PCB type suits high-density electronic projects requiring complex circuitry?

  • How to ensure proper soldering and maintenance for multilayer PCB assemblies?

  • FR-4 vs alternative materials: Which is better for cost-effective PCB assembly?

  • Can I customize PCB designs with specific components for IoT or networking devices?

  • Are your PCBs UL-certified for safety compliance in industrial applications?

  • Does the PCB support customization for specific power or signal requirements?

  • Which PCB assembly service suits networking equipment with USB interfaces?

  • Can I order PCBs with non-standard dimensions or layer counts?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material & ComplianceEU-regulated electronics, Industrial IoTIndustry: FR-4 (ISO 178: 240 MPa) + Basic RoHS
Base: FR-4 + UL Recognized (E159458) ▲
Advanced: FR-4 + UL + EPR France/Germany ▲▲
Advanced meets EU EPR mandates; Base ensures UL safety complianceEPR certifications add 15% cost; Industry lacks modern compliance standards
Layer CountHigh-density servers, Medical devicesIndustry: 2-6 layers (IPC-6012) ▲
Base: 4-16 layers ▲▲
Advanced: 8-32 layers (IPC-6012) ▲▲▲
Advanced supports complex designs (e.g., 5G modems); Base reduces layer costsAdvanced requires 30% longer lead times; Industry limits dense applications
Signal IntegrityHigh-speed data comms, Automotive ECUsIndustry: ±20% impedance tolerance (IPC-2141) ▲
Base: ±10% ▲▲
Advanced: ±5% ▲▲▲
Advanced minimizes crosstalk (ideal for LiDAR sensors); Base suits consumer gearTighter tolerances increase manufacturing costs by 25% for Advanced tiers
Thermal PerformancePower electronics, EV battery managementIndustry: Standard thermal vias (IPC-2221) ▲
Base: Enhanced thermal vias (0.3mm spacing) ▲▲
Advanced: Thermal pads + vias (ASTM D648) ▲▲▲
Advanced handles 50°C+ heat (e.g., solar inverters); Base improves thermal dissipationAdvanced requires advanced solder mask techniques, raising defect risks by 10%
Customization FlexibilityNiche defense, Aerospace systemsIndustry: Fixed 4-layer designs ▲
Base: 1-16 layers + standard components ▲▲
Advanced: 1-32 layers + custom components ▲▲▲
Advanced accommodates radar systems; Base suits IoT devicesCustom components may delay delivery by 2-3 weeks; Industry lacks scalability
Environmental ComplianceEU consumer electronics, Green initiativesIndustry: RoHS-only ▲
Base: RoHS + UL ▲▲
Advanced: RoHS + UL + EPR France/Germany ▲▲▲
Advanced qualifies for EU e-waste programs; Base avoids RoHS penaltiesEPR compliance requires tracking software investments (€5k+ annually)

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